High Power 3 Layer HASL Flexible Aluminum PCB Board Manufacturing Customizable
Customizable High Power Carrying Aluminum Base PCB Manufacturing
♦ What is Aluminum PCB?
Aluminum substrate is a functional circuit board with aluminum (or aluminum alloy) as the base material. It is mainly composed of circuit layer (copper foil), insulation layer and metal base layer. Its core value lies in efficient heat dissipation and high power carrying capacity. It is widely used in electronic devices that are sensitive to heat or require high current drive.
♦ Features of Aluminum PCB
-
- Excellent heat dissipation performance: The core advantage of aluminum-based PCBs is the high thermal conductivity of the substrate itself (the thermal conductivity of aluminum is usually 150~240 W/(m·K), much higher than the 0.3~0.5 W/(m·K) of ordinary FR-4 epoxy resin boards). Heat can be quickly transferred to the housing or heat sink through the aluminum substrate to avoid local overheating.
- Good electrical performance: The dielectric constant of the insulating layer is usually 3~5 (lower than 4~5 of FR-4, but higher than ceramic substrate), which is suitable for medium and high frequency circuits (but high frequency applications still require ceramic substrates).
- High rigidity: The mechanical strength of aluminum substrate is better than that of organic substrates such as FR-4, and it has strong resistance to bending and vibration, making it suitable for scenarios with high requirements for structural stability (such as automobiles and industrial equipment).
♦ Applications of Aluminum PCB
-
- LED lighting: High-power LED lamp beads (such as street lights, stage lights, and car headlights) need to dissipate heat quickly to improve light efficiency and life.
- Power module: High-power density circuits such as switching power supplies and inverters rely on aluminum substrates to reduce temperature rise.
- Automotive electronics: Stable operation in high-temperature environments such as engine control units, car light drivers, and charging piles.
- Audio equipment: Amplifier circuits use aluminum substrates to reduce the impact of heat on sound quality.
Industrial control: High-power consumption equipment such as motor drives and power converters.
♦ Technical Parameters
|
Item |
Specification |
|
Laers |
1~32 |
|
Board thickness |
0.1mm-7.0mm |
|
Material |
FR-4,CEM-1/CEM-3,PI,High Tg,Rogers |
|
Max panel size |
32"×48"(800mm×1200mm) |
|
Min hole size |
0.075mm |
|
Min line width |
3mil(0.075mm) |
|
Surface finish |
OSP,HASL,Imm Gold/Nickel/Ag, Electric gold |
|
Copper thickness |
0.5-7.0OZ |
|
Soldermask |
Green/Yellow/Black/White/Red/Blue |
|
Silkscreen |
Red/Yellow/Black/White |
|
Min PAD |
5mil(0.13mm) |
|
Inter package |
Vacuum |
|
Outer package |
Carton |
|
Outline tolerance |
±0.75mm |
|
Hole tolerance |
PTH:±0.05 NPTH:±0.025 |
|
Certificate |
UL,ISO 9001,ISO14001,IATF16949 |
|
Special request |
Blind hole+Gold finger + BGA |
|
Material Suppilers |
Shengyi, KB, Nanya, ITEQ,etc. |
Get in Touch
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