Thick Copper Turnkey Prototype Assembly Rohs Circuit Board PCB Double Layer For Industrial Inverter
Double Layer 4OZ Thick Copper PCB Blind Buried Via for Industrial Inverter
♦ What is Thick copper PCB?
Thick copper PCB refers to a circuit board formed by bonding a layer of copper foil with a thickness of 2 ounces (oz, about 62.5 microns) or more to FR-4 or other substrates during the printed circuit board (PCB) manufacturing process.
♦ Features of Thick Copper PCB
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- High current carrying capacity: Thick copper reduces resistance, carries 100A current, and improves power density.
- Strong heat dissipation: Fast heat conduction, temperature rise can be controlled within 40°C.
- High mechanical strength: Vibration and shock resistance, adaptable to harsh working conditions.
- High frequency stability: Low signal attenuation, supports high-speed transmission.
- High reliability: Wide temperature operation (-40°C~150°C), long-term stability.
♦ Applications of Thick Copper PCB
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- Power supply equipment: high-power switching power supply, inverter, UPS, etc.
- Automotive electronics: electric vehicle motor controller, on-board charger, battery management system.
- Industrial control: motor driver, servo controller, welding equipment.
- New energy field: photovoltaic inverter, wind power converter.
- High-power LED lighting: LED driver board that needs heat dissipation and current carrying.
♦ Typical Application Scenarios of Thick Copper PCB
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Power conversion equipment: photovoltaic inverters, electric vehicle OBCs and server power supplies use ≥4oz thick copper plates + heat dissipation design to control temperature rise <40℃.
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Industrial control: PLC, inverters, etc. use double-layer 3oz thick copper plates + blind holes to achieve compact layout.
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New energy field: energy storage busbars and fuel cell boards use ≥5oz thick copper + nickel plating (≥5μm) for corrosion protection.
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♦ Technical Parameters
|
Item |
Specification |
|
Laers |
1~32 |
|
Board thickness |
0.1mm-7.0mm |
|
Material |
FR-4,CEM-1/CEM-3,PI,High Tg,Rogers |
|
Max panel size |
32"×48"(800mm×1200mm) |
|
Min hole size |
0.075mm |
|
Min line width |
3mil(0.075mm) |
|
Surface finish |
OSP,HASL,Imm Gold/Nickel/Ag, Electric gold |
|
Copper thickness |
0.5-7.0OZ |
|
Soldermask |
Green/Yellow/Black/White/Red/Blue |
|
Silkscreen |
Red/Yellow/Black/White |
|
Min PAD |
5mil(0.13mm) |
|
Inter package |
Vacuum |
|
Outer package |
Carton |
|
Outline tolerance |
±0.75mm |
|
Hole tolerance |
PTH:±0.05 NPTH:±0.025 |
|
Certificate |
UL,ISO 9001,ISO14001,IATF16949 |
|
Special request |
Blind hole+Gold finger + BGA |
|
Material Suppilers |
Shengyi, KB, Nanya, ITEQ,etc. |
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