1.5mm Low CTE TG170 PCB Board Fabrication And Assembly Lead Free
Lead Free Low CTE High Tg PCB Suitable for A Variety Of Extreme Environments
♦ What's High-Tg?
Tg refers to the glass transition temperature. When the substrate is exposed to high temperatures, it will change from a glass state to a rubber state. High Tg PCB refers to a circuit board that can withstand higher temperatures without deforming or turning into rubber. Materials with a glass transition temperature above 170°C are usually classified as high Tg PCBs, those above 150°C are mid-range Tg PCBs, and those above 130°C are low Tg PCBs.
♦ Advantages of High Tg PCB
-
- Improve product reliability: Stable physical and electrical performance in extreme environments, suitable for fields with high reliability requirements such as aerospace, automotive electronics, etc.
- Extend service life: Resistant to moisture and chemical corrosion, reduce maintenance costs, and bring economic benefits.
- Adapt to lead-free process: Can remain stable at higher welding temperatures, which is conducive to improving production efficiency and product quality.
- Support high-density interconnection technology: Meet the needs of miniaturization and lightweight of modern electronic equipment, making PCB design more refined and layout more compact.
♦ Application fields of High-Tg PCB
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- Communication field: widely used in wireless base stations, optical fiber communications, satellite communications and other equipment, supporting high-speed signal transmission, adapting to high temperature and high frequency environments, and ensuring stable operation of communication networks.
- Automotive field: used in vehicle computers, engine control units, new energy battery management systems, etc., to withstand high temperatures, vibrations and complex environments, and improve the reliability of automotive electronic systems.
- Industrial field: suitable for industrial automation equipment, PLCs, converters, etc., can work stably in high temperature, high humidity, and strong vibration environments, ensuring long-term and reliable operation of industrial equipment.
♦ Technical Parameters
|
Item |
Specification |
|
Laers |
1~32 |
|
Board thickness |
0.1mm-7.0mm |
|
Material |
FR-4,CEM-1/CEM-3,PI,High Tg,Rogers |
|
Max panel size |
32"×48"(800mm×1200mm) |
|
Min hole size |
0.075mm |
|
Min line width |
3mil(0.075mm) |
|
Surface finish |
OSP,HASL,Imm Gold/Nickel/Ag, Electric gold |
|
Copper thickness |
0.5-7.0OZ |
|
Soldermask |
Green/Yellow/Black/White/Red/Blue |
|
Silkscreen |
Red/Yellow/Black/White |
|
Min PAD |
5mil(0.13mm) |
|
Inter package |
Vacuum |
|
Outer package |
Carton |
|
Outline tolerance |
±0.75mm |
|
Hole tolerance |
PTH:±0.05 NPTH:±0.025 |
|
Certificate |
UL,ISO 9001,ISO14001,IATF16949 |
|
Special request |
Blind hole+Gold finger + BGA |
|
Material Suppilers |
Shengyi, KB, Nanya, ITEQ,etc. |
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