High Precision BGA Assembly Electronic Prototype Board IPC-A-610 Certified
High-Precision BGA Assembly Services with IPC-A-610 Certified
♦ What Is BGA Assembly Service?
BGA Assembly Services refer to specialized PCB (Printed Circuit Board) assembly processes designed to handle Ball Grid Array (BGA) components, a type of advanced surface-mount packaging used in modern electronics.
♦ Key Features of BGA Assembly Services:
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BGA Soldering
- Uses reflow soldering to attach BGA components, where solder balls melt to form electrical connections.
- Requires precise temperature control to prevent defects like voids or cold joints.
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High-Density PCB Support
- BGAs allow for more connections in a smaller space, making them ideal for compact, high-performance devices (e.g., CPUs, GPUs, smartphones, IoT devices).
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Advanced Inspection & Testing
- X-ray inspection (AXI) checks for hidden solder defects (e.g., bridging, misalignment).
- Electrical testing ensures functionality.
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BGA Rework & Repair
- Reballing: Replacing damaged solder balls.
- Replacement: Removing and replacing faulty BGAs without damaging the PCB.
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Materials & Techniques
- Underfill epoxy (for mechanical stability in high-stress environments).
- Controlled atmosphere soldering (to reduce oxidation).
♦ Why Are BGA Assembly Services Important?
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- Complexity: BGAs are harder to solder than traditional components (e.g., QFP, SOIC) due to hidden solder joints.
- Reliability: Proper assembly prevents failures in critical applications (medical, aerospace, automotive).
- Miniaturization: Supports high-density designs in modern electronics.
DQS Electronic Group is one of the leading EMS company in China, we provide PCB design, PCB manufacturing, PCB assembly service and testing. Welcome send us your Gerber file to get free quotation. Our email: sales@dqspcba.com
♦ Technical Parameters
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PCB Assembly Capability |
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Item |
Normal |
Special |
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SMT Assembly |
PCB(used for SMT) specification |
Length and Width( L* W) |
Minimum |
L≥3mm, W≥3mm |
L＜2mm |
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Maximum |
L≤800mm, W≤460mm |
L ＞ 1200mm, W＞500mm |
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Thickness( T) |
Thinnest |
0.2mm |
T＜0.1mm |
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Thickest |
4 mm |
T＞4.5mm |
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SMT components specification |
Outline Dimension |
Min size |
0201(0.6mm*0.3mm) |
01005(0.3mm*0.2mm) |
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Max size |
200 * 125 |
200 * 125 |
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component thickness |
T≤15mm |
6.5mm＜T≤15mm |
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QFP,SOP,SOJ (multi pins) |
Min pin space |
0.4mm |
0.3mm≤Pitch＜0.4mm |
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CSP/ BGA |
Min ball space |
0.5mm |
0.3mm≤Pitch＜0.5mm |
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DIP Assembly |
PCB specification |
Length and Width( L* W) |
Minimum |
L≥50mm, W≥30mm |
L＜50mm |
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Maximum |
L≤1200mm, W≤450mm |
L≥1200mm, W≥500mm |
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Thickness( T) |
Thinnest |
0.8mm |
T＜0.8mm |
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Thickest |
3.5mm |
T＞2mm |
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- On-time Delivery:
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- Owned PCBA factories 15,000 ㎡
- 13 fully automatic SMT lines
- 4 DIP assembly lines
2. Quality Guaranteed:
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- IATF, ISO, IPC, UL standards
- Online SPI, AOI, X-Ray Inspection
- The qualified rate of products reach 99.9%
3. Premium Service:
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- 24H reply your inquiry
- Perfect after-sales service system
- From prototype to mass production
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.