Heat Dissipation BGA DIP Electronic PCBA Motherboard Componente
Efficient Heat Dissipation Electronic PCBA as Laptop Motherboard
♦ What is Consumer Electronics PCBA?
Consumer Electronics PCBA (Consumer Electronics Printed Circuit Board Assembly) is the core circuit board of consumer electronic products (such as mobile phones, TVs, headphones, etc.). Components are integrated on the PCB through SMT patch and DIP plug-in processes to achieve device function control and data processing.
♦ Features of Laptop Motherboard PCBA
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- High integration: Using surface mount technology, etc., a large number of electronic components are integrated in a limited space to achieve complex functions.
- Lightweight and portable: Using light and thin PCB materials, combined with compact design, to meet the portability requirements of notebooks.
- Efficient heat dissipation: Through reasonable layout and heat dissipation design, such as large-area heat sinks, heat pipes, etc., the heat generated by CPU, GPU, etc. can be effectively dissipated.
- Stable and reliable: After rigorous testing and inspection, it has good electrical performance and mechanical stability, and can adapt to different usage environments
♦ Applications of Consumer Electronics PCBA
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- Mobile phones/tablets: integrated chips, communication modules, support high-performance computing and portable design.
- Computers/laptops: motherboard core, carrying processors, memory and multi-interface functions.
- Audio-visual equipment: signal processing and interactive control of TVs, game consoles, and speakers.
- Smart home: communication and logic control of smart speakers, thermostats and other devices.
- Wearable devices: miniaturized and highly integrated solutions for smart watches and health monitoring equipment.
- Photographic imaging: image processing and storage control of cameras and camcorders.
- Home appliances: functional realization of smart home appliances such as microwave ovens and washing machines.
♦ DQS's PCB Assembly Capability
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Item |
Normal |
Special |
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SMT Assembly |
PCB(used for SMT) specification |
Length and Width( L* W) |
Minimum |
L≥3mm, W≥3mm |
L<2mm |
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Maximum |
L≤800mm, W≤460mm |
L > 1200mm, W>500mm |
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Thickness( T) |
Thinnest |
0.2mm |
T<0.1mm |
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Thickest |
4 mm |
T>4.5mm |
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SMT components specification |
Outline Dimension |
Min size |
0201(0.6mm*0.3mm) |
01005(0.3mm*0.2mm) |
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Max size |
200 * 125 |
200 * 125 |
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component thickness |
T≤15mm |
6.5mm<T≤15mm |
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QFP,SOP,SOJ (multi pins) |
Min pin space |
0.4mm |
0.3mm≤Pitch<0.4mm |
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CSP/ BGA |
Min ball space |
0.5mm |
0.3mm≤Pitch<0.5mm |
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DIP Assembly |
PCB specification |
Length and Width( L* W) |
Minimum |
L≥50mm, W≥30mm |
L<50mm |
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Maximum |
L≤1200mm, W≤450mm |
L≥1200mm, W≥500mm |
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Thickness( T) |
Thinnest |
0.8mm |
T<0.8mm |
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Thickest |
3.5mm |
T>2mm |
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♦ One-Stop Electronic Manufacturing Including
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PCB Prototype |
Quick Turn PCB |
Single-Sided PCB |
Double-Sided PCB |
Multilayer PCB |
Rigid PCB |
|
Flexible PCB |
Rigid-Flex PCB | Rigid-Flex PCB | Aluminum PCB | Metal Core PCB |
Thick Copper PCB |
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HDI PCB |
BGA PCB | High TG PCB | PCB Stencil | Impedance Control PCB |
PCB Assembly |
| High-Frequency PCB | Bluetooth Circuit Board | Automotive PCB | USB Circuit Board | Halogen-Free PCB |
Antenna PCB |
♦ Core Competencies of DQS PCB Assembly
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