HASL Flexible Printed Bendable Circuit Board FPC PCB Double Sided 0.5OZ
Double Sided Flexible PCB Bending Resistant Flexible Connection
♦ What is Flexible PCB
Flexible PCB (FPC), also called a "soft board" or flexible circuit, is a type of printed circuit board (PCB) made from flexible insulating materials, such as polyimide (PI) or polyester (PET), instead of rigid fiberglass (FR4). This unique construction allows FPCs to bend, fold, and twist without breaking, enabling compact, lightweight, and space-saving designs in modern electronics.
♦ Features of Flexible PCB
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- Ultra-thin and light: PI substrate, weight reduction and space saving.
- High flexibility and bending resistance: can be bent repeatedly (more than 10,000 times).
- Miniaturization: supports micron-level circuits and high-density integration of components.
- 3D adaptation: fits complex shapes and reduces assembly processes.
- Stable and reliable: resistant to high and low temperatures (-40℃~+125℃), vibration and shock.
♦ Difficulties in Flexible PCB Manufacturing
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Base material is fragile: PI film is thin and easy to wrinkle and crack, low-tension precision processing is required.
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Micro-line is difficult to control: micron-level line width/spacing, electroplating and hole filling are prone to defects.
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Strict alignment: multi-layer lamination requires high precision, and offset affects yield.
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Surface sensitivity: The plating needs to balance flexibility and conductivity, and the process window is narrow.
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Complex detection: internal line defects are difficult to detect, relying on expensive equipment such as X-ray.
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♦ Applications of Flexible PCB
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Smartphones & Wearables (foldable screens, flexible displays);
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Laptops & Tablets (hinge connections, battery flex cables);
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Automotive Electronics (sensors, lighting, dashboard controls);
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Medical Devices (implantable electronics, diagnostic equipment);
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Aerospace & Defense (lightweight, high-reliability circuits).
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♦ Technical Parameters
|
Item |
Spec |
|
Layers |
1~64 |
|
Board Thickness |
0.1mm-10 mm |
|
Material |
FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc |
|
Max Panel Size |
800mm×1200mm |
|
Min Hole Size |
0.075mm |
|
Min Line Width/Space |
Standard: 3mil(0.075mm) Advance: 2mil |
|
Board Outline Tolerance |
士0.10mm |
|
Insulation Layer Thickness |
0.075mm--5.00mm |
|
Out Layer Copper Thickness |
18um--350um |
|
Drilling Hole (Mechanical) |
17um--175um |
|
Finish Hole (Mechanical) |
17um--175um |
|
Diameter Tolerance (Mechanical) |
0.05mm |
|
Registration (Mechanical) |
0.075mm |
|
Aspect Ratio |
17:01 |
|
Solder Mask Type |
LPI |
|
SMT Min. Solder Mask Width |
0.075mm |
|
Min. Solder Mask Clearance |
0.05mm |
|
Plug Hole Diameter |
0.25mm--0.60mm |
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