12 Layers HDI High Frequency Rigid PCB

♦ What is HDI (High-Density Interconnect)?

HDI (High-Density Interconnect)​​ refers to a ​​PCB (Printed Circuit Board) technology​​ that enables higher wiring density per unit area compared to traditional PCBs. HDI boards use ​​finer traces, smaller vias, and tighter spacing​​ to accommodate complex, compact electronic devices like smartphones, wearables, and advanced medical equipment.

​​Key Characteristics:​​

1. 1. ​​Microvias​​ (laser-drilled, smaller than mechanical drills)
      • Blind vias (connect outer to inner layers)
      • Buried vias (connect inner layers only)
      • Stacked or staggered microvias (for ultra-high density)
   2. ​​Finer Trace Width/Spacing​​ (as low as ​​2/2 mil or less​​)
   3. ​​Thinner Materials​​ (for lightweight, flexible designs)
   4. ​​Sequential Lamination​​ (multiple lamination cycles for complex layer transitions)
   5. ​​Via-in-Pad & Filled Vias​​ (for better component mounting)

♦ ​​​​​​HDI vs. Standard PCB: Key Differences​​?​

♦ Technical Parameters

♦ One-Stop PCBs Solution

 

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♦ Advantages of DQS Team

1. On-time Delivery:  

• • Owned PCBA factories 15,000 ㎡
  • 13 fully automatic SMT lines 
  • 4 DIP assembly lines

 

     2. Quality Guaranteed:

• • IATF, ISO, IPC, UL standards 
  • Online SPI, AOI, X-Ray Inspection 
  • The qualified rate of products reach 99.9%

 

     3. Premium Service:

• • 24H reply your inquiry
  • Perfect after-sales service system
  • From prototype to mass production