One Stop SMT PCB Assembly Board Fab Service For Consumer Electronics
One-Stop SMT PCB Manufacturing for Consumer Electronics
♦ What is SMT PCB Manufacturing?
SMT (Surface Mount Technology) PCB Manufacturing is the process of assembling printed circuit boards by mounting electronic components directly onto the surface of the PCB using automated machines, as opposed to through-hole technology (THT), where components are inserted into drilled holes.
♦ Key Steps in SMT PCB Manufacturing
1. PCB Fabrication (Before SMT Assembly)
-
- The bare PCB is manufactured with solder pads (no holes needed for SMT components).
- Common materials: FR-4, aluminum, or flexible substrates.
2. Solder Paste Application
-
- Stencil Printing: A metal stencil aligns with the PCB, and solder paste (a mix of tiny metal balls and flux) is applied to the pads.
3. Component Placement
-
- Pick-and-Place Machines automatically pick SMDs (Surface Mount Devices) from reels/trays and place them on the solder paste with high precision.
- Components include resistors, capacitors, ICs (QFN, BGA), and more.
4. Reflow Soldering
-
- The PCB passes through a reflow oven, where controlled heating melts the solder paste, forming permanent electrical connections.
- Temperature profile: Preheat → Soak → Reflow → Cooling.
5. Inspection & Testing
-
- AOI (Automated Optical Inspection) – Checks for misalignment, solder defects.
- X-Ray Inspection – For hidden joints (e.g., BGA components).
- Functional Testing – Validates the assembled PCB’s performance.
♦ SMT vs. Through-Hole (THT) PCB Assembly
| Feature | SMT PCB Assembly | Through-Hole (THT) Assembly |
|---|---|---|
| Component Size | ✅ Tiny (0201, 0402) | ❌ Larger (leaded parts) |
| Speed | ✅ Faster (automated) | ❌ Slower (manual/semi-auto) |
| Cost | ✅ Lower (mass production) | ❌ Higher (labor-intensive) |
| PCB Space | ✅ High-density | ❌ Requires more space |
| Strength | ⚠️ Less mechanical strength | ✅ Better for high-stress environments |
♦ Technical Parameters
|
Item |
Spec |
|
Layers |
1~64 |
|
Board Thickness |
0.1mm-10 mm |
|
Material |
FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc |
|
Max Panel Size |
800mm×1200mm |
|
Min Hole Size |
0.075mm |
|
Min Line Width/Space |
Standard: 3mil(0.075mm) Advance: 2mil |
|
Board Outline Tolerance |
士0.10mm |
|
Insulation Layer Thickness |
0.075mm--5.00mm |
|
Out Layer Copper Thickness |
18um--350um |
|
Drilling Hole (Mechanical) |
17um--175um |
|
Finish Hole (Mechanical) |
17um--175um |
|
Diameter Tolerance (Mechanical) |
0.05mm |
|
Registration (Mechanical) |
0.075mm |
|
Aspect Ratio |
17:01 |
|
Solder Mask Type |
LPI |
|
SMT Min. Solder Mask Width |
0.075mm |
|
Min. Solder Mask Clearance |
0.05mm |
|
Plug Hole Diameter |
0.25mm--0.60mm |
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