ENIG TG180 Communication Flex PCB Assembly Fabrication Service
TG180 Communication PCB Manufacturing
♦ What's PCB Manufacturing?
PCB (Printed Circuit Board) manufacturing is the process of designing and producing the physical boards that mechanically support and electrically connect electronic components using conductive pathways, tracks, or signal traces etched from copper sheets laminated onto a non-conductive substrate.
♦ Key Steps in PCB Manufacturing:
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Design & Layout
- The PCB design is created using software (e.g., Altium Designer, KiCad, Eagle).
- Schematics are converted into a physical layout with copper traces, pads, and vias.
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Printing the Design
- The design is printed onto a film or directly transferred to the board using a photolithographic process.
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Substrate Preparation
- The base material (usually FR4 fiberglass) is coated with a thin layer of copper.
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Etching
- Unwanted copper is chemically removed, leaving only the desired conductive traces.
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Drilling
- Holes are drilled for through-hole components and vias (electrical connections between layers).
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Plating & Copper Deposition
- The holes are plated with copper to ensure conductivity between layers.
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Solder Mask Application
- A protective layer (usually green) is applied to prevent short circuits and oxidation.
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Silkscreen Printing
- Component labels, logos, and identifiers are printed on the board.
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Surface Finish
- Exposed copper pads are coated with a finish (e.g., HASL, ENIG, OSP) to prevent corrosion and improve solderability.
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Testing & Inspection
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- Automated optical inspection (AOI), electrical testing, and functional checks ensure quality.
♦ Types of PCBs:
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- Single-layer PCBs – Simplest, with one conductive layer.
- Double-layer PCBs – Conductors on both sides.
- Multi-layer PCBs – Used in complex electronics (e.g., smartphones, computers).
- Flexible PCBs – Made with bendable materials for wearables and compact devices.
- Rigid-Flex PCBs – Combine rigid and flexible sections.
♦ Technical Parameters
|
Item |
Specification |
|
Laers |
1~64 |
|
Board thickness |
0.1mm-10.0mm |
|
Material |
FR-4,CEM-1/CEM-3,PI,High Tg,Rogers |
|
Max panel size |
32"×48"(800mm×1200mm) |
|
Min hole size |
0.075mm |
|
Min line width |
3mil(0.075mm) |
|
Surface finish |
OSP,HASL,Imm Gold/Nickel/Ag, Electric gold |
|
Copper thickness |
0.5-7.0OZ |
|
Soldermask |
Green/Yellow/Black/White/Red/Blue |
|
Silkscreen |
Red/Yellow/Black/White |
|
Min PAD |
5mil(0.13mm) |
|
Inter package |
Vacuum |
|
Outer package |
Carton |
|
Outline tolerance |
±0.75mm |
|
Hole tolerance |
PTH:±0.05 NPTH:±0.025 |
|
Certificate |
UL,ISO 9001,ISO14001,IATF16949 |
|
Special request |
Blind hole+Gold finger + BGA |
|
Material Suppilers |
Shengyi, KB, Nanya, ITEQ,etc. |
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.


