YL Electrical Equipment (Tianjin) Co., Ltd.
                                                                                                           
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14 Years
Since 2012
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PLC Control Contact Card Production Line IC Module Automatic Glue Tape Lamination Machine

Price Negotiable
Price: negotiable
MOQ: 1 set
Delivery Time: 30-35days
Brand: YL
Product Description
Contact IC Chip Tape Glue Preparation Machine for 6 Pin Chip And 8 Pin Chip
Product Specifications
Attribute Value
Power Around 1.0kW
Power supply AC220V 50/60 HZ
Compressed air 6kg/cm² (dry oil free)
Speed 1 9000~12000 chips/hour (2 times of hot welding)
Speed 2 15000~18000 chips/hour (1 time of hot welding)
Module specification ISO standard contact IC card chip tape (M3/8-pin & M2/6-pin)
Product Overview

The YCGP-1 Contact IC Chip Tape Glue Preparation Machine features PLC program automatic control and uses imported high-quality stepper motors for precise glue preparation with fast production speed and high precision.

YCGP-1 Contact IC Chip Tape Glue Preparation Machine
Key Features
  • Integrated system for IC module strip transportation, hot melt adhesive application, and finished product collection
  • Hot welding glue preparation welding head features automatic correction and balance structure design for better results
  • Position fine-tuning mechanism for higher punching precision and easier operation
  • Modular design allows easy replacement for different IC module types
  • Automatic monitoring with electric sensor eye for position protection
  • Automatic material feed and discharge with alarm system
YCGP-1 Machine in operation
Technical Parameters
Power AC220V 50/60 HZ
Main Power Around 1.0 KW
Compressed air 6kg/cm² (dry oil free)
Air consumption Around 30L/min
Net Weight Around 400Kg
Control mode PLC + stepper system
Speed 9000~12000 chips/hour (2 times hot welding)
15000~18000 chips/hour (1 time hot welding)
Operator 1 person
Bonding mode Hot melt glue (like Tesa 8410, Scapa G175 or similar)
Module specification ISO standard contact IC card chip tape (M3/8-pin & M2/6-pin)
Machine size Around L1700×W800×H1600mm
Technical details of YCGP-1 machine
Applications

The YCGP-1 is designed for preparation and processing of various contact IC chip or module tapes, including 6-pin chip and 8-pin chip configurations.

YCGP-1 machine application examples

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company YL Electrical Equipment (Tianjin) Co., Ltd.
Location No. 843 Shengli St., Dagang, Binhai New Area, Tianjin, China
Contact Person Karl Bing

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