Industrial Photoelectric Sensors Measurement Shock Resistance 50G F.S. 8mm
| Attribute | Value |
|---|---|
| Weight | Cable Type: 65g |
| Storage Temperature | -20~60°C |
| Storage Humidity | 35~95%RH (no Condensation Or Icing) |
| Spot Size (max.) Near Range | 0.15x0.15mm |
| Spot Size (max.) Far Range | 0.15x0.15mm |
| Linearity Accuracy | ±0.1%F.S. |
| Housing Material | Housing: PBT, Lens: PMMA |
| Spot Size (max.) Center Range | 0.1x0.1mm |
The Photoelectric Sensors product offers reliable detection capabilities for various applications. With a spot size (max.) far range of 0.15x0.15mm, these sensors deliver precise and accurate results. The IEC/JIS Rating (FDA Rating) of Class 2 (Class II) ensures compliance with industry standards, making them suitable for a wide range of environments.
A CMOS Laser Displacement Photoelectric Sensor is a high-precision sensor that uses a laser beam and a CMOS image chip to measure the exact distance between the sensor and a target surface without touching it.
| Cable Type | 2CH | KD50-50N |
|---|---|
| Output Signal | Switching output: NPN (-N) |
| Detection Range | 50±10mm |
| Full Scale(F.S.) | 20mm |
| Light Source | Red Laser diode (wavelength 655nm) |
| IEC/JIS Rating(FDA Rating) | Class 2(Class Ⅱ) |
| Sampling Period | 500(250mm:750)/1000/1500/2000μs |
| Response Time |
High-speed Mode: max.5ms Standard Mode: max.12.5ms High-resolution Mode: max.36.5ms |
| Sensitivity Switch Time | 4ms max. |
| Operating Temp./Humidity | -10~45° C/35~85%RH (no condensation or icing) |
| Shock Resistance | 50G(500m/s²) |
| Housing Material | Housing: PBT Lens: PMMA |
| Vibration Resistance | 10~55Hz, double amplitude 1.5mm, X,Y,Z directions, 2 hour for each |
KRONZ Photoelectric Sensors are versatile devices suitable for a wide range of applications across various industries. With a compact design and high precision technology, these sensors offer reliable performance in different scenarios.
- PCB Component Height Inspection: Measures the height of chips, capacitors, and other components on printed circuit boards to ensure proper placement.
- Die Bonding and Chip Alignment: Ensures precision alignment of chips during packaging and bonding processes.
- Wafer Thickness and Warpage Detection: Used in wafer polishing or cutting processes to control material removal and prevent damage.
- FPC (Flexible PCB) Thickness Measurement: Ensures uniform lamination and layer thickness in flexible circuit boards.
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