170mic Polyamide Hot Melt Adhesive for Leather Shoes - 80-90°C Melting Temperature, 10-20 Second Open Time

Price Negotiable

Price: USD 3.00 - 9.00 /KG

MOQ: 1000KG

Delivery Time: 8-10 days

Brand: JCC

Product Description

Product Overview

Our Modified Polyamide (PA) Hot Melt Adhesive Series delivers high-performance bonding solutions engineered through advanced polycondensation technology. These premium-grade adhesives are specifically formulated for demanding industrial applications, providing exceptional adhesion, durability, and resistance to heat, oil, and chemicals.

Technical Specifications

Attribute	Value
Material	Polyamide
Color	Light yellow
Form	Granule and powder
Melting Temperature	80-90°C
Peel Strength	High
Open Time	10-20 seconds
Chemical Resistance	Good
Weather Resistance	Good

Performance Data

Series	Type	Form	Melting Range	Melting Flow Index @160°C, 2.16kg
PA Material	JCC-2080	Powder, Granule	80-90°C	45-75 g/10min

Recommended Bonding Conditions

Temperature	Pressure	Time
100-110°C	2.0 kgf/m²	10-15 seconds

Key Features & Advantages

Excellent adhesion to leather, fabric, and foam substrates
Fast setting with strong initial tack for efficient production
High heat resistance and flexibility for lasting performance
Smooth surface compatibility prevents bleed-through or damage
Good resistance to moisture, sweat, and wear

Primary Applications

Laminating leather to textile linings in formal shoes
Bonding insoles and inner footwear structures
Layering foam or padding in high-comfort shoe designs

Storage & Handling

Store in a cool, dry, well-ventilated area. Avoid exposure to high temperatures and direct sunlight. Unopened products maintain usability for 12-24 months.