Low Temperature Lamination Copolyamide Hot Melt Adhesive Powder for Color Retention - 110-120°C Application, 70-110°C Melting Range
Price:
USD 5.0 - 9.0 /KG
MOQ:
1000KG
Delivery Time:
8-10 days
Brand:
JCC
Product Description
Product Overview
JCC Low-Temperature Lamination PA Powder is a specialized copolyamide hot melt adhesive engineered for bonding heat-sensitive fabrics while preserving original color vibrancy. With application temperatures of 110-120°C, this powder adhesive enables efficient lamination without exposing materials to high heat that causes discoloration or fading.
Key Specifications
| Attribute | Value |
|---|---|
| Composition | Copolyamide |
| Type | Hot Melt Adhesive Powder |
| Application Temperature | 110-120°C |
| Melting Range | 70-110°C |
| MFR (160°C) | 27-33 g/10min |
Technical Features
- Low-temperature bonding prevents color change and dye migration
- Maintains fabric aesthetics and color integrity
- Suitable for heat-sensitive materials including polyester and nylon
- Soft and flexible adhesive layer maintains fabric drape
- Wash and dry-clean resistant performance
- Eco-friendly, solvent-free formulation
- Compliant with REACH, RoHS, and OEKO-TEX standards
Primary Applications
- Heat transfer labels and patches
- Embroidery backing and badge bonding
- Shoe and apparel textile composites
- Automotive and interior textiles
- Lamination processes including powder scattering and mesh film bonding
Performance Advantages
- Low processing temperature (110-120°C) protects delicate fabrics
- Excellent bonding strength with flexible adhesion
- Superior color retention for dyed and printed textiles
- Solvent-free and environmentally compliant
Technical Data
| Type | Melting Range (°C) | MFR (g/10min, 160°C) | Pressing Temp (°C) | Dry Cleaning |
|---|---|---|---|---|
| JCC-PA6091 | 70-110 | 27-33 | 110-120 | Yes |
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Company
Tianyang New Materials (Shanghai) Technology Co.,Ltd
Location
No. 505 Huiping Rd Nanxiang Jiading District Shanghai 201802 China
Contact Person
Chloe