Modified PA Polyamide Hot Melt Adhesive Powder - 125℃ Softening Point, 13500 mPa.s Viscosity for Heat Shrink Tube Laminating

Modified Polyamide PA Hot Melt Adhesive represents a new generation of high-performance bonding solution developed through advanced polycondensation modification technology. Based on polyamide resin chemistry, this adhesive delivers exceptional physical and chemical properties for demanding industrial applications.

• Excellent heat resistance, low-temperature resistance, and oil resistance
• High flexibility without brittleness for durable bonds
• Wide adhesion range - bonds effectively with metals, plastics, and rubbers
• Superior electrical insulation properties for electrical applications

Heat shrink tubing provides essential insulation, waterproof sealing, and mechanical protection for wires and cables. This modified polyamide hot melt adhesive is pre-applied to the inner wall to enhance bonding during the shrinking process.

• Melts and flows during heating to fill gaps completely
• Forms strong adhesion with substrates including copper, aluminum, and cable jackets
• Provides reliable moisture-proof and waterproof sealing
• Enhances electrical insulation and mechanical strength
• Ensures long-term durability and reliability of tubing installations

Modified polyamide (PA) hot melt adhesive is a thermoplastic bonding resin derived from polycondensation modification of polyamide polymers, offering superior performance characteristics.

When heat shrink tubing is applied, the inner adhesive layer melts, flows, and bonds securely to underlying substrates such as copper wire, aluminum, or cable jackets, creating a permanent protective seal.

Yes. The adhesive provides excellent dielectric strength and insulation properties, making it ideal for electrical and electronic applications where reliable insulation is critical.