Ultra-Thin 0.01mm to 0.1mm Pure Copper Foil with Bright Polished Surface for Precision Electronics
Introducing our Ultra-Thin Pure Copper Strip and Foil series, manufactured by cold-rolling process with thicknesses ranging from 0.01mm to 0.1mm. This product is designed for applications requiring exceptional electrical conductivity, thermal transfer, and corrosion resistance in extremely thin gauges.
Produced from 99.99% pure copper (grades including T1, T2, C11000, C10200 OFC), our copper foil offers excellent ductility, allowing for tight bending, stamping, and deep drawing without cracking. The bright polished surface ensures low contact resistance, making it the top choice for precision electronics, grounding straps, and heat dissipation components.
With a low MOQ of 500kg and seaworthy export packaging, this coil/foil is ready for global OEM and industrial supply chains. Free samples are available for qualified testing.

| Product | Copper Sheet, Plate, Coil, Strip, Foil |
| Steel Grade | Pure Copper: T1,T2,T3,C11000,C11100,C11300,C11400,C11500,C1100 TU1,TU2,C10200,C1020 TP1,TP2,C12000,C12200,C14500,C14700,C15000,C1201,C1220 TAg0.1,C11600 Brass: H96,H90,H85,H80,H70,H68,H68A,H65,H63,H62,H59,H70A,H85A. C21000,C22000,C23000,C24000,C26000,C26000,C27000,C27200,C27400,C28000 C2100,C2200,C2300,C2400,C2600,C2700,C2720,C2801 |
| Thickness | 0.2mm-50mm |
| Width | 10mm-2500mm, custom. |
| Manufacturing Method | Cold Rolled, Hot Rolled |
| Surface | Bright polished |
| MOQ | 500 KG |
| Free Samples | Available |
| Per Coil Weight | 1-8 tons |
| Package | Seaworthy packing with wooden pallets and waterproof paper |
| Leading time | Usually 7-15 days, if in stock 1-3 days. |
| Payment terms | T/T 30% for deposit. 70% balance before shipment |
| Delivery Terms | FOB/CIF/CFR/EXW |

- EMI / RFI Shielding: Flexible gaskets for electronic enclosures and 5G equipment.
- Lithium-Ion Batteries: Negative electrode current collector tabs and connectors.
- Flexible Printed Circuits (FPC): Base material for conductive layers.
- Lightning Protection: Grounding straps and static discharge brushes.
- Heat Dissipation: Thermal interface materials between CPUs, LEDs, and heat sinks.
- Decorative & Craft: Metal inlay, art foil, and architectural cladding.
- Transformers & Inductors: Winding foil for high-frequency transformers.
- Electrical Conductivity (Skin Effect): At high frequencies, electrical current travels on the surface of a conductor (Skin Effect). The bright polished, ultra-thin profile (0.01mm–0.1mm) maximizes surface-area-to-volume ratio, reducing AC resistance and improving efficiency in RF circuits and transformers.
- Thermal Equilibrium: Copper has a high thermal conductivity (~400 W/mK). When placed between a heat source and a sink, the thin foil creates a low-impedance path for phonons (heat energy), quickly spreading and transferring heat away from sensitive components.
- Electromagnetic Field Attenuation (Shielding): When used as a shield, the conductive copper foil reflects incident electromagnetic waves. The thin gauge allows the material to be conformable (bends around cables or enclosures), creating a continuous conductive barrier that absorbs and guides interference currents to ground.
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