Rotary Table Pulse Bonding Hot Bar Soldering Machine with 3,900N Force and 0.25mm Pitch for Flexible Circuits

The YSPC-1A Rotary Table Pulse Bonding Hot Bar Soldering Machine delivers exceptional performance for bonding challenging components and materials. This advanced equipment is specifically engineered for flexible circuits, ribbon cables, wire-to-PCB connections, flex-to-LCD assemblies, and thermo compression bonding applications across telecommunications, computer, automotive, and display industries.

• Molybdenum alloy soldering head for superior temperature stability and rapid heating
• Digital temperature control with clear display for precise thermal management
• Digital pressure meter with preset pressure range capability
• Advanced PID control system with phase angle drive technology
• Minimal vibration and noise operation with stable voltage performance
• Adjustable soldering head leveling for uniform assembly processing

• Rotary table design enables extremely short cycle times
• Simultaneous product loading/unloading during heat sealing process
• Real-time pressure sensor triggered bonding cycle
• Floating thermode ensures consistent pressure and heat transfer
• Precision product fixtures with micrometer alignment and vacuum component fixation
• Optional CCD alignment module available for fine pitch applications