H900 Fully Automatic Solder Paste Printer - 900×350mm Board Capacity, ±0.015mm Accuracy, 1500kg Industrial SMT Equipment

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Product Description

Product Overview

The High-Precision Fully Automatic Solder Paste Printer H900 is engineered for demanding SMT production environments, delivering exceptional accuracy and efficiency for PCB assembly operations.

Performance Specifications

Parameter	Specification
Repeat Position Accuracy	±0.015mm
Print Accuracy	±0.03mm
Cycle Time	<15 seconds
Maximum Board Size	900 × 350mm
Machine Weight	Approximately 1500kg

Technical Parameters

Parameter	Value
Power Source	AC:220V ±10%, 50/60Hz, 3KW
Air Pressure	4-6 Kgf/cm²
Air Consumption	Approximately 5L/min
Operating Temperature	-20℃ to +45℃
Working Environment Humidity	30% to 60%
Machine Dimensions	1970(L) × 1210(W) × 1509(H) mm

Substrate Processing Capabilities

Parameter	Specification
Board Size Range	80×50mm to 900×350mm
Board Thickness	0.8-6mm
Maximum Board Weight	10kg
Transport Speed	Up to 1500mm/s

Advanced Features

Image and Optical System: Uniform ring light with high brightness coaxial light and adjustable brightness for reliable mark point recognition across various PCB types
2D Solder Paste Inspection: Real-time detection of printing defects including deviation, lack paste, miss paste, and paste joint issues
Electric Control System: Safe and organized circuit distribution with easy access for maintenance
User Interface: Chinese/English operating system with comprehensive monitoring and diagnostic capabilities
Print Head Design: Programmable floating print heads with adjustable stepping motor for consistent pressure and paste savings

SMT Factory Solutions

We provide complete SMT solutions including core technology, professional technical service, and comprehensive factory setup support with extensive industry experience.