The JG18 PWB UV Laser Cutting Machine provides precise cutting of FPC and organic membrane cover boards without requiring molds or cover plates. High-energy laser emission and precise beam control enhance processing speed and accuracy.

• Independent intellectual property rights for control software with user-friendly interface
• Complete functionality and simple operation for various graphics processing
• Capable of cutting different thicknesses and materials with layered processing and synchronous closing
• High-power UV laser with short wavelength, high beam quality, and superior peak power characteristics
• UV light cutting through splitting and precise evaporation instead of melting materials
• Minimal burrs after processing with small thermal effect and no delamination
• Smooth cutting effects with clean side walls and minimal charring
• Fixed sample positioning using vacuum mode without matrix cover plate
• Compatible with various substrate materials including silicon, ceramic, and glass
• Self-correction, automatic positioning, and multi-board cutting functions
• Automatic board thickness measurement and compensation
• Full stop motion compensation function for improved cutting accuracy
• Reduced horizontal vibration and enhanced depth cutting precision
• Improved efficiency when cutting complex patterns