The YSL-1000SD Semi Automatic Dicing System utilizes a precision cutting blade mounted on a high-speed spindle to perform accurate cutting operations on various materials including glass, ceramic, semiconductor chips, PCB boards, and EMC wire frames.

This semi-automatic system requires manual loading and unloading, while the cutting procedure is fully automated.

1. Operator manually places material on work platform
2. Automatic position calibration and alignment
3. Press start button for automated dicing process
4. Operator manually removes finished material

Ideal for precision cutting of semiconductor chips, LED chips, EMC lead frames, PCB boards, IR filters, sapphire glass, and ceramic thin plates.

• Clean compressed air: atmospheric pressure dew point -10~-20°C, residual oil ≤0.1ppm
• Ambient temperature: 20~25°C (±1°C fluctuation)
• Cutting water temperature: 22~27°C (±1°C variation)
• Installation in vibration-free environment away from heat sources

• Blade damage detection function
• Automatic setting function
• Dicing visual function
• 3-inch dicing blade compatibility

• Reduced loading times with larger 12-inch chuck
• Accommodates larger product sizes
• Increases overall efficiency by over 8%