YSHP-1A FPC to PCB Pulse-Heated Soldering Machine with 0-400℃ Temperature Range and 3900N Force

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Product Description
Product Overview
Advanced FPC to PCB pulse-heated soldering machine featuring precision thermode technology for high-quality bonding of flexible circuits to printed circuit boards.
Key Features
  • Rotary table design enables simultaneous loading/unloading during heat sealing for extremely short cycle times
  • High precision heat sealing capability up to 0.25mm pitch for fine-pitch applications
  • Pneumatic bonding head delivers up to 3,900N force for consistent pressure application
  • Digital programmable pressure control with LCD display for precise force management
  • Closed-loop PID temperature control with LED display for accurate thermal regulation
  • Real-time pressure sensor triggering for precise bonding cycle initiation
  • Floating thermode design ensures uniform pressure and heat transfer across flex foil to LCD/PCB
  • Dual precision product fixtures with micrometer alignment and vacuum component fixation
  • Optional CCD alignment module with camera, lens, monitor and illumination for ultra-fine pitch applications
  • Full microprocessor logic control for automated operation
Technical Specifications
Parameter Specification
Model YSHP-1A
Dimensions 500mm × 750mm × 910mm
Working Air Pressure 0.5-0.7 MPA
Working Area 110mm × 150mm
Temperature Range 0-400℃
Temperature Tolerance ±2℃
Pressing Time 0-99 seconds
Pressure Tolerance 0.05 MPA
Technology Description
Hot bar soldering technology provides exceptional effectiveness in bonding dissimilar components and parts that are challenging to unite. This pulse bonding system utilizes advanced thermode technology based on rapid reflow through pulse heating. The process enables materials with low temperature resistance to be soldered at high lead-free temperatures without damaging the flexible circuits. Selective soldering is achieved by heating components to temperatures sufficient to melt adhesives or solder, which then re-solidify to form permanent, reliable bonds.
Product Images
FPC to PCB pulse-heated soldering machine front view showing control panel and work area Close-up view of the bonding head and precision alignment system Side view of the rotary table design and pneumatic components Detailed view of the digital controls and LCD display interface Operational demonstration of the FPC to PCB bonding process

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company YUSH Electronic Technology Co.,Ltd
Location 5th Floor, No.10, Shanquan Road, Yongtou Village, Chang’an Town, Dongguan City, Guangdong province, China.
Contact Person Eva Liu

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