10W UV Laser Cutting Machine for Flexible Printed Circuits with ±1μm Repeatability and 610×460mm Processing Area

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Price: Negotiable

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Delivery Time: Negotiable

Product Description

Product Overview

10W UV laser cutting machine designed for precision processing of flexible printed circuits (FPC) and organic membrane cover boards. This CNC laser engraving system offers high-speed, high-accuracy cutting without requiring molds or cover plates.

Key Applications

Precision cutting of FPC and organic membrane cover boards
Processing various substrate materials including silicone, ceramic, and glass
Industrial applications in machinery, hardware, and chemical sectors

Technical Features

Independent intellectual property control software with user-friendly interface
High-power UV laser with short wavelength and superior beam quality
Vaporization-based cutting technology minimizes burrs and thermal effects
Vacuum mode sample fixation eliminates need for matrix cover plates
Self-correction, automatic positioning, and multi-board cutting functions
Automatic board thickness measurement and compensation
Full stop motion compensation for enhanced accuracy

Technical Specifications

Parameter	Specification
Processing Accuracy	±20μm
Positioning Accuracy	±3μm
Repeatability Accuracy	±1μm
Cutting Speed	≥150mm/s
Maximum Cutting Thickness	≤1.0mm
Maximum Processing Size	610×460mm or 610×500mm (optional)
Machine Dimensions	1800×1600×1700mm
Machine Weight	2500kg