YSL-1000SD Semi Automatic Dicing System with 300mm Processing Diameter and 60,000 RPM Spindle for Precision Cutting
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The YSL-1000SD Semi Automatic Dicing System utilizes high-speed spindle rotation to drive slim cutting blades for precision dicing of various materials including glass, ceramic, semiconductor chips, PCB boards, and EMC wire frames.
Operation Process
This semi-automatic system requires manual loading and unloading while automating the core dicing procedure. The process includes wafer or strip tape mounting, dicing, cleaning, and UV separation stages.
Main Procedures
- Manual material placement on work platform
- Automatic cutting position calibration
- Automated dicing process activation
- Manual material removal from platform
Applications
Ideal for precision cutting of semiconductor chips, LED chips, EMC lead frames, PCB boards, IR filters, sapphire glass, and ceramic thin plates.
Operating Requirements
- Clean compressed air: -10 to -20°C dew point, 0.1ppm residual oil, 0.01μm/99.5% filtering accuracy
- Ambient temperature: 20-25°C (±1°C fluctuation)
- Cutting water temperature: 22-27°C (±1°C variation)
- Cooling water temperature: 20-25°C (±1°C variation)
- Vibration-free environment away from high-temperature devices
Key Features
- Touch LCD interface with multiple language support (Chinese, English, Korean)
- High precision cutting for materials up to 300mm diameter
- High rigidity structure for cutting stability
- CCD automatic alignment system
- Real-time monitoring of air pressure, water pressure, and current
- 2.4kW cutting spindle with maximum 60,000 rpm
- 0.001mm repeat positioning accuracy
- Cutting speed range: 0.05-400 mm/sec
- Standard 2-inch blade compatibility (maximum 3-inch)
Technical Specifications
| Parameter | Unit | Specification |
|---|---|---|
| Processing Dimensions | mm | Φ300 |
| X-axis Working Stroke | mm | 340 |
| Y-axis Working Stroke | mm | 310 |
| Repeat Positioning Accuracy | mm | 0.001 / 310 |
| Z-axis Working Stroke | mm | 60 (2 Inch blade) |
| Spindle Power | KW | 2.4 |
| Spindle Speed | Rpm | 5000-60000 |
| Machine Power | KW | 4 |
| Power Air Pressure | MPa | 0.5-0.6 |
| Physical Dimensions | mm | 1040×1080×1750 |
| Machine Net Weight | KG | 850 |
Optional Equipment
- Blade damage detection function
- Automatic setting function
- Dicing visual function
- 3-inch dicing blade compatibility
Efficiency Advantages
- Reduces loading times with 12-inch chunk capacity
- Accommodates larger product sizes
- Improves overall efficiency by over 8%
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
YUSH Electronic Technology Co.,Ltd
Location
5th Floor, No.10, Shanquan Road, Yongtou Village, Chang’an Town, Dongguan City, Guangdong province, China.
Contact Person
Eva Liu