YS-X5600 Microfocus X-Ray Inspection System with 2.5μm Defect Detection and CNC Automation for Semiconductor BGA Analysis
Price:
USD31940
MOQ:
1
Delivery Time:
20work days
Brand:
YUSH
Product Description
YS-X5600 Microfocus X-Ray Inspection System
Advanced microfocus X-ray inspection system designed for precision component analysis with 2.5μm defect detection capability.
Industry Applications
| Semiconductor | Automotive Electronics | PCB Assembly | LED |
| BGA/QFN Inspection | Aluminum Die Casting | Mould | Electrical & Mechanical Components |
| Biological Agriculture Seed | Aviation Components | Wheel Hub | Wire/USB/Plug |
Key Features & Advantages
| Function | Advantages |
|---|---|
| X-ray detector moves along Z direction; adjustable X-Y table speed | Larger effective detection range, improved magnification and detection efficiency |
| Long life X-ray tube, maintenance free | Japanese Hamamatsu X-ray source for reliability |
| 2.5μm defect detection capability with high repeat accuracy | Easy identification of gold wire bending and breakage in semiconductor packages |
| Powerful CNC measuring function with programmable automation | Suitable for large-scale inspection with improved efficiency |
| Compact design with minimal space requirements | Ideal for laboratories and materials rooms |
| Large navigation view with mouse-click positioning | Easy operation for quick defect identification |
Application Advantages
- Miniaturized equipment for easy installation and operation
- Compatible with Chip, BGA/CSP, Wafer, SOP/QFN, SMT and PTU packaging
- High resolution design for optimal imaging in minimal time
- Infrared automatic navigation and positioning for quick location selection
- CNC inspection mode for rapid multi-point array analysis
- Inclined multi-angle inspection for enhanced defect detection
- Simple software operation with low operating costs
- Extended system lifespan
BGA Inspection Capabilities
YS-X5600 features automatic void ratio calculation and enhanced BGA inspection functions. The system can quickly select and mark individual solder balls or use matrix box selection for targeted inspection. Manual or automatic BGA solder ball identification ensures complete inspection coverage. Following system guidelines guarantees accurate and reliable inspection results.
X-Ray Working Principle
CNC Programming Features
- Simple mouse-click programming interface
- X-Y table positioning with Z-axis X-ray tube movement
- Software-controlled voltage and current settings
- Comprehensive image settings: brightness, contrast, auto gain and exposure
- Customizable pause time for program conversion
- Anti-collision system for maximum tilt and workpiece observation
- Automatic analysis of diameter, cavity proportion, area and roundness for BGA components
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
YUSH Electronic Technology Co.,Ltd
Location
5th Floor, No.10, Shanquan Road, Yongtou Village, Chang’an Town, Dongguan City, Guangdong province, China.
Contact Person
Eva Liu