YS-X6600 Microfocus X-Ray Inspection System with 60° Tilt Angle and 2.5μm Detection Capability for BGA and Semiconductor Analysis

Price Negotiable

Price: USD38650

MOQ: 1

Delivery Time: 20work days

Brand: YUSH

Product Description

Applications

Semiconductor	Automotive electronics	PCB Assembly	LED
BGA/QFN inspection	Aluminum die casting	Mould	Electrical and mechanical components
Biological agriculture seed	Aviation component	Wheel hub	Wire/USB/Plug

Key Features and Advantages

Function	Advantages
X-ray tube and detector Z-axis movement with adjustable X-Y table speed	Larger effective detection range, improved magnification and detection efficiency
High-definition digital flat panel detector with 60° max inclined angle	Easy defect identification from multiple perspectives with no dead angle detection
Long life X-ray tube with lifetime maintenance-free operation	Utilizes world-class Japanese Hamamatsu X-ray source technology
2.5μm minimum detectable fault with high repeat accuracy	Precise detection of gold wire bending and breaks in semiconductor packages
Powerful CNC measuring with automated testing and programmable editing	Ideal for large-scale inspection operations with enhanced efficiency
Large inspection space with 10kg load capacity	Accommodates large industrial control boards, LED strips, and various electronic products
Large navigation view with mouse-click positioning	Intuitive operation for quick defect identification and improved efficiency

Hardware Specifications

Tube type	Sealed microfocus X-ray tube
Tube voltage	Adjustable tube voltage
Tube current	10-200μA (software limited to 89μA)
Focal spot size	5-15μm
Cooling method	Convection cooling
Detector type	HD digital flat panel detector (FPD)
Imaging area	130mm × 130mm
Pixel matrix	1536 × 1536 pixels
Inclined angle	0-60°
Repeated test accuracy	3μm
Software inspection speed	3.0s/point (excluding loading/unloading time)
Standard size	540mm × 450mm
Effective inspection area	500mm × 420mm
Load capacity	≤5kg
Operating platform	Mouse, keyboard, 2 operating modes
Inner lead plate	5mm thick lead plate (radiation isolation)
Dimensions	1245mm(L) × 1230mm(W) × 1900mm(H)
Weight	1170kg
Power supply	AC 110-220V (±10%) international power supply

Software Capabilities

BGA short detection	Automatic recognition using preset NG image comparison
BGA false solder detection	Automatic recognition using preset NG image comparison
Area measurement	Preset area size standards with NG product prompt function
Size measurement	Distance, gold line curvature, slope, angle measurements
Automatic positioning	Power-on table auto zero function with system reset
Control mode	CNC automatic control, manual control via keyboard and mouse (3 modes)

CNC Programming Features

Simple mouse-click programming interface
X, Y, Z axis positioning control for object table and X-ray components
Software-controlled voltage and current settings
Comprehensive image settings: brightness, contrast, auto gain and exposure
User-configurable pause time for program conversion
Anti-collision system for maximum workpiece tilt and observation
Automatic analysis of diameter, cavity proportion, area and roundness for BGA components

X-Ray Working Principle