2 Layer Rogers 4350B Ceramic PCB Double Sided Circuit Board

• Layer: 2
• Material: Rogers ceramic
• Copper weight: 1OZ
• Surface finish: HASL lead free
• Board thickness: 1.6mm
• Solder mask: Green

Ceramic PCB substrates include several types:

• High temperature fusion ceramic substrate (HTFC)
• Low temperature co-fired multilayer ceramic (LTCC)
• High temperature co-fired multilayer ceramic (HTCC)
• Direct bonding copper substrate (DBC)
• Direct Copper Plating (DPC)

Ceramic PCBs are ideal for high pressure, high insulation, high frequency, high temperature applications requiring reliability and compact size. These boards combine noble metals with high-conductivity dielectric circuits and thermally conductive insulating materials to effectively dissipate heat from electronic components, enhancing stability and extending service life.

Key Material Properties:

• Base materials: 96% or 98% Alumina (Al2O3), Aluminum Nitride (AIN), or Beryllium Oxide (BeO)
• Conductor materials: Silver palladium (AgPd), gold palladium (AuPd) for thin/thick film; Copper for DCB
• Operating temperature range: -55°C to 850°C
• Thermal conductivity: 24-28W/m-K (Al2O3); 150-240W/m-K (AIN); 220-250W/m-K (BeO)
• Compression strength: >7,000 N/cm²
• Breakdown voltage: 15/20/28 KV/mm for 0.25mm/0.63mm/1.0mm thickness

• High-precision clock oscillators and temperature compensation oscillators
• Refrigeration system ceramic substrates
• Surface-mount inductive ceramic substrates
• Power electronic control modules requiring high insulation
• High-temperature circuit applications
• Solid state relays
• DC-DC module power supplies
• Automotive and motorcycle regulators/ignition modules
• Power transmitter modules