6L Rogers RO4350B FR4 Hybrid High Frequency PCB Board 1.6mm
| Attribute | Value |
|---|---|
| Layer | 6 |
| Material | Rogers RO4350B + FR4 Hybrid |
| Type | High Frequency PCB |
| Min Line Space | 4mil |
| Hole | Resin plug hole |
| Min. Line Width/Spacing | 4mil/4mil |
| Panel | 1*1 |
| Solder Mask Type | Liquid Photo Imageable (LPI) |
| Min. Hole Size | 0.2mm |
| Board Thickness | Mechanical drill: 8mil(0.2mm) |
| Panel Size | 3*2 |
| Layers | 4350+4450F |
- Material: Rogers RO4350B
- Layers: 6
- Board thickness: 1.6mm
- Copper: 1OZ
- Dielectric thickness: 0.508mm
- Dielectric constant: 3.48
- Thermal conductivity: 0.69w/m.k
- Flame retardant rating: V-0
- Volume resistivity: 1.2*1010
- Surface resistivity: 5.7*109
- Density: 1.9gm/cm3
- Surface finish: Immersion gold
- Application: Radio frequency communication
Rogers PCBs are printed circuit boards manufactured using Rogers Corporation's high-performance materials, designed for applications requiring superior high-frequency performance, electrical properties, and thermal stability. These materials feature low dielectric loss, high dielectric constant, and excellent signal integrity.
The RO4000 series, including RO4350B, RO4003C, and RO3003, is particularly popular for high-frequency applications in wireless communication systems, radar systems, aerospace, and satellite systems. Compared to standard FR-4 PCBs, Rogers PCBs offer lower insertion loss, reduced signal distortion, and higher reliability, though at a higher cost.
- Iterative Design: Expect multiple iterations for optimal RF performance, especially with antenna designs
- 4-Layer Recommendation: Preferred over 2-layer designs for better RF performance with continuous ground planes
- 50Ω Standard: Design traces and components for 50Ω impedance matching
- RF-First Layout: Prioritize RF trace routing before other components
- Isolation Techniques: Use via stitching to isolate RF traces from other signals
- Low Inductance Grounding: Multiple ground vias for RF chipsets and continuous ground planes
- Plating/Copper: Gold plating recommended for RF components with proper copper management
- Routing Considerations: Short traces, proper corner routing, and orthogonal orientation for sensitive traces
- Continuous Ground Planes: Avoid breaking ground planes under RF traces
Ideal for 5G technology and high-frequency applications requiring low electrical noise and minimal signal loss:
- Automotive radar and sensors
- Microwave equipment
- Cellular base station antennas
- RF identification (RFID) tags
- 5G stations
- Microwave point-to-point (P2P) links
- LNBs for direct broadcast satellites
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