4 Layer Rogers Microwave RF PCB 0.14mm-3.0mm Thickness
Price:
USD0.1-1000
MOQ:
1pcs
Delivery Time:
5-8 working days
Brand:
ONESEINE
Product Description
5oz EMC RF Microwave Printed Circuit Boards PCB 0.14mm~3.0mm Thickness
Product Specifications
| Product Attributes | Microwave PCB, RF PCB, 2 Layer PCB, HF PCB |
| Impedance Value | 10% |
| Layer | 4 Layer |
| Base Material | Rogers |
| Board Thickness | 0.14mm~3.0mm |
| Copper Thickness | 0.5 OZ in all layer |
| Dielectric Constant | 3.5 - 10.2 |
| Copper Weight | Inner 1/2 oz-4oz; Outer 1oz-5oz |
Reliable Supplier Microwave Circuit Board RF High Frequency PCB
Microwave PCB Information
| Base Material | Rogers 4350 |
| Board Thickness | 0.8mm |
| Layer | 2 |
| Board Size | 9*12cm |
| Surface Finish | Immersion Gold |
| Line Space | 6mil |
| Copper Thickness | 1OZ |
| Line Width | 6mil |
Microwave Definition
Microwaves are electromagnetic spectrum allocations by definition referring to the wavelength range from 1m to 0.1mm electromagnetic waves, with corresponding frequencies from 0.3GHz to 3000GHz. This spectrum includes decimeter (0.3GHz-3GHz), centimeter (3GHz-30GHz), millimeter (30GHz-300GHz), and sub-millimeter (300GHz-3000GHz) wave bands.
Microwave PCBs must use high frequency printed circuit boards (Rogers/Taconic/Arlon/Isola etc) for applications above 1GHz.
Microwave PCB Materials
- Rogers4003C: Thickness (0.254, 0.508, 0.813, 1.524) DK 3.38
- Rogers4350B: Thickness (0.254, 0.508, 0.762, 1.524) DK 3.5
- Rogers5880: Thickness (0.254, 0.508, 0.762) DK 2.2
- Rogers3003: Thickness (0.127, 0.508, 0.762, 1.524) DK 3
- Rogers3010: Thickness (0.635) DK 10.2
- Rogers3206: Thickness (0.635) DK 10.2
- Rogers3035: Thickness (0.508) DK 3.5
- Rogers6010: Thickness (0.635, 1.27) DK 10.2
High Frequency PCB Range
High-frequency PCBs operate from MHz to GHz and THz ranges, used in wireless communication systems, radar, satellite communication, and high-speed data transmission.
Key Features of High Frequency PCBs
- Minimized signal loss and dispersion through low-loss dielectric materials
- Controlled impedance routing for consistent performance
- Optimized PCB stackup configuration for signal integrity
- Specialized RF connectors for proper signal transmission
- EMC compliance through proper grounding and shielding
- Advanced simulation and analysis during design phase
- Precision fabrication with tight tolerances
- Rigorous testing including impedance and signal integrity analysis
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Company
ONESEINE TECHNOLOGY CO.,LTD
Location
F6,Fangdichan building,Guicheng south,Nanhai,Foshan,China
Contact Person
Tracy