2 Layer GSM Antenna PCB High Frequency RT Duroid 5880

2 Layer GSM Antenna PCB Circuit Board Design with High Frequency RT Duroid 5880 PCB Substrate

• Product name: 2 Layer Antenna Circuit Board High Frequency RT Duroid 5880 PCB Substrate
• Brand Name: ONESEINE
• Base Material: Rogers5880
• Copper Thickness: 1OZ
• Board Thickness: 0.8mm
• Min. Hole Size: 0.2mm
• Min. Line Width: 4mil
• Min. Line Spacing: 4mil
• Surface Finishing: ENIG
• Certificate: RoSH ISO9001 UL
• Board Thickness Tolerance: +/-10%
• Hole tolerance: PTH: +/-3mil NPTH: +/-2mil
• Min distance pad-pad: 8mil
• Min distance trace-pad: 8mil
• Min distance trace-via: 4mil
• PCB Standard: IPC-A-610 D
• Shipping: DHL UPS TNT Fedex
• Inner Package: Vacuum package

Designed for optimal performance in high-frequency applications ranging from MHz to GHz and THz ranges, including wireless communication systems, radar, satellite communication, and high-speed data transmission.

Key technical considerations include:

• Minimized signal loss and dispersion through low-loss dielectric materials
• Controlled impedance routing for signal integrity
• Optimized PCB stackup configuration with multiple copper layers
• Specialized RF connectors for consistent impedance
• EMC compliance through proper grounding and shielding
• Advanced simulation and analysis during design phase
• Precision fabrication with tight tolerances
• Rigorous testing including impedance and signal integrity analysis