ONESEINE TECHNOLOGY CO.,LTD
                                                                                                           
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13 Years
Since 2013
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High Frequency 2 Layer Communication PCB 1OZ 35um

Price Negotiable
Price: USD0.1-1000
MOQ: 1pcs
Delivery Time: 5-8 working days
Brand: ONESEINE
Product Description
Communication HF PCB Circuit Board 1OZ 4mil 35um Small Batch Production
Product Specifications
Attribute Value
Product Type Communication PCB
Material High Frequency
Layer Count 2 layer
Copper Weight 1OZ
Min Line Width 4mil
Mechanical Rigid Rigid
Feature Batch Customized Production
Copper Weight 35um
PCB Technical Details
  • Application Products: Power Amplifier
  • Number of layers: 2
  • Surface treatment: OSP
  • Material: PTFE F4B
  • PCB size: 180*50mm
  • Outer line width/line spacing: 7/7mil
  • Inner line width/line spacing: 5/5mil
  • Board thickness: 2.3mm
  • Minimum aperture: 0.6mm
Precision High-Frequency PCBs for Mission-Critical Communication Systems

Engineered for demanding signal integrity in 5G, RF, and satellite applications, our high-frequency PCBs deliver GHz+ performance with exceptional reliability.

Why Our PCBs Dominate Critical Communication Hardware
  • Ultra-Low Signal Loss: Rogers/Taconic laminates with Dk=2.0-10.6 & controlled ±1.5% impedance tolerance
  • 1OZ Heavy-Copper Advantage: Enhanced current handling + thermal management for power amplifiers and base stations
  • Strict Handling Protocols: ESD-controlled environment | Vacuum-sealed packaging | Moisture-sensitive component (MSD) compliance
  • High-Frequency Expertise: 40+ layer builds | PTFE substrates | Laser-drilled microvias down to 0.1mm
  • Rigorous Testing: TDR analysis | Insertion loss measurements | Time-domain reflectometry
Applications We Enable
5G NR mmWave Antenna Arrays Satellite Communication Terminals Radar and Avionics Systems High-Speed Backplane Interconnects IoT Gateway RF Modules
Certified Reliability

ITAR Registered | ISO 9001:2015 | IPC-6012 Class 3 | RoHS 3.0 Compliant

High-Frequency PCB Design Considerations

Via Design: Vias can impact signal integrity at high frequencies. Our PCBs use techniques like back drilling or buried vias to minimize signal reflections and maintain signal integrity across layers.

Component Placement: Careful consideration is given to component placement to minimize signal path lengths, reduce parasitic capacitance and inductance, and optimize signal flow.

Shielding: To minimize electromagnetic interference (EMI) and RF leakage, our PCBs employ shielding techniques such as copper pours, ground planes, or metal shielding cans.

Industry Applications

Our high-frequency PCBs serve critical applications in wireless communication systems, aerospace, radar systems, satellite communication, medical devices, and high-speed data transmission.

High frequency PCB board with detailed circuitry Close-up view of high frequency PCB components

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company ONESEINE TECHNOLOGY CO.,LTD
Location F6,Fangdichan building,Guicheng south,Nanhai,Foshan,China
Contact Person Tracy

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