High Frequency 2 Layer Communication PCB 1OZ 35um
| Attribute | Value |
|---|---|
| Product Type | Communication PCB |
| Material | High Frequency |
| Layer Count | 2 layer |
| Copper Weight | 1OZ |
| Min Line Width | 4mil |
| Mechanical Rigid | Rigid |
| Feature | Batch Customized Production |
| Copper Weight | 35um |
- Application Products: Power Amplifier
- Number of layers: 2
- Surface treatment: OSP
- Material: PTFE F4B
- PCB size: 180*50mm
- Outer line width/line spacing: 7/7mil
- Inner line width/line spacing: 5/5mil
- Board thickness: 2.3mm
- Minimum aperture: 0.6mm
Engineered for demanding signal integrity in 5G, RF, and satellite applications, our high-frequency PCBs deliver GHz+ performance with exceptional reliability.
- Ultra-Low Signal Loss: Rogers/Taconic laminates with Dk=2.0-10.6 & controlled ±1.5% impedance tolerance
- 1OZ Heavy-Copper Advantage: Enhanced current handling + thermal management for power amplifiers and base stations
- Strict Handling Protocols: ESD-controlled environment | Vacuum-sealed packaging | Moisture-sensitive component (MSD) compliance
- High-Frequency Expertise: 40+ layer builds | PTFE substrates | Laser-drilled microvias down to 0.1mm
- Rigorous Testing: TDR analysis | Insertion loss measurements | Time-domain reflectometry
ITAR Registered | ISO 9001:2015 | IPC-6012 Class 3 | RoHS 3.0 Compliant
Via Design: Vias can impact signal integrity at high frequencies. Our PCBs use techniques like back drilling or buried vias to minimize signal reflections and maintain signal integrity across layers.
Component Placement: Careful consideration is given to component placement to minimize signal path lengths, reduce parasitic capacitance and inductance, and optimize signal flow.
Shielding: To minimize electromagnetic interference (EMI) and RF leakage, our PCBs employ shielding techniques such as copper pours, ground planes, or metal shielding cans.
Our high-frequency PCBs serve critical applications in wireless communication systems, aerospace, radar systems, satellite communication, medical devices, and high-speed data transmission.
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