ONESEINE TECHNOLOGY CO.,LTD
                                                                                                           
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13 Years
Since 2013
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Custom Rigid Flex PCB Board FR4 FPCA with Immersion Gold Finish

Price Negotiable
Price: USD0.1-1000
MOQ: 1pcs
Delivery Time: 5-8 working days
Brand: ONESEINE
Product Description
PET FR4 FPCA Printed Rigid Flex Circuit Boards Fabrication Assembly
Product Specifications
Attribute Value
Pcb Size Customized
Solder Mask Green, Red, Blue, Black, White
Legend White
OEM Custom
IPC Class Class 2
Stiffener Material Type PI / FR4 / PET / Steel piece
Surface Finished Immersion gold
Board Type FPCA
6 Layer Flex Rigid PCB Manufacturer FR4 Circuit Materials Fabrication
Material: Polymide flex FR4 rigid
Brand: Oneseine
Number of layers: 6
Board thickness: 1.6mm rigid & 0.2mm flex
Minimum aperture: 0.15mm
Minimum line width/line spacing: 0.08mm
Copper thickness: 1OZ each on the inner and outer layers
Solder resistance: green oil with white letters
Surface technology: sinking gold
Product features: 0.1mm hole to line, 0.2mm BGA pad, resin plug required for holes in the pad
Rigid-Flex PCB Applications in Smartphones and Tablets
Rigid-flex PCBs are extensively used in modern smartphones and tablets, enabling compact, lightweight, and flexible electronic assemblies that fit within slim, curved form factors.
Key Components Connected by Rigid-Flex PCBs:
  • Processor and memory chips: Rigid sections provide stable mounting for main processor, RAM, and essential ICs
  • Display and touch panel: Flexible portions allow seamless integration with edge-to-edge designs
  • Camera module: Flexible sections enable optimal positioning in tight spaces
  • Battery and peripherals: Ensures efficient power distribution and signal routing
This technology contributes to sleek, ergonomic designs while improving durability through shock and vibration absorption.
Rigid-Flex PCB Advantages
  • Structural Integrity: Rigid sections provide stability while flexible portions allow bending and folding
  • Space Optimization: Enables routing through tight spaces and complex 3D shapes
  • Enhanced Reliability: Flexible sections better withstand bending and vibrations
  • Manufacturing Efficiency: Automated fabrication reduces production costs
Manufacturing Process and Challenges
Production Steps:
  • Multilayer lamination of rigid and flexible materials
  • Rigid-flex structuring through selective etching
  • Interconnect formation via vias and plated through-holes
  • Circuit patterning using photolithography
  • Component assembly and rigorous testing
Key Challenges:
  • Thermal management in densely packed designs
  • Balancing flexibility with long-term durability
  • Maintaining dimensional stability during production
  • Material compatibility to prevent delamination
  • Achieving high-density miniaturization

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company ONESEINE TECHNOLOGY CO.,LTD
Location F6,Fangdichan building,Guicheng south,Nanhai,Foshan,China
Contact Person Tracy

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