Custom Multilayer FR4 PCB Board with 50ohm 75ohm Impedance Control
Price:
USD0.1-1000
MOQ:
1pcs
Delivery Time:
5-8 working days
Brand:
ONESEINE
Product Description
Custom Industrial Control Multilayer PCB Board Design 50ohm 75ohm Impedance Control
Product Specifications
| Material | FR4 |
| Layers | Multilayer |
| Location | China |
| Type | RGD ROHS PCB |
| Impedance Control | 50ohm, 75ohm, 100ohm, etc. |
| Min Hole | 0.2MM |
| Copper Thickness | 1 oz |
Product Description
Multilayer Fr4 14 Layer Industrial Control PCB Circuit Board
PCB Parameters
Layer: 14
Material: Fr4
Board thickness: 4.8mm
Surface finish: Immersion gold
Min hole: 4/4mil
Inner line width/gap: 4/4mil
Application: Industrial control circuit board
Multilayer PCB Types
- Standard Multilayer PCB: Basic type with 4-8 layers for general electronic devices
- High-Density Interconnect (HDI) PCB: Features microvias for compact devices like smartphones
- Flex and Rigid-Flex PCB: Combines flexible and rigid sections for wearable and medical devices
- Sequential Lamination PCB: For complex designs requiring 10+ layers
- Metal Core PCB: Aluminum/copper core for superior heat dissipation in power electronics
- RF/Microwave PCB: Specialized for high-frequency applications in wireless communications
Applications
- Consumer Electronics: Smartphones, tablets, laptops, TVs
- Telecommunications: Routers, switches, base stations
- Automotive: Engine control, ADAS, infotainment systems
- Industrial Equipment: Control systems, robotics, automation
- Aerospace/Defense: Avionics, radar, satellite systems
- Medical Devices: Diagnostic tools, imaging systems
- Power Electronics: Inverters, converters, power supplies
Production Process
- Design and CAM processing
- Material preparation and inner layer processing
- Outer layer processing with soldermask application
- Multilayer lamination under heat and pressure
- Plating and surface finish application
- Routing and V-cut separation
- Component assembly and soldering
- Testing and quality inspection
- Packaging and shipping
PCB Stack-Up Configuration
Our multilayer PCBs feature optimized layer arrangements including:
- Signal layers for electrical routing
- Power and ground planes for stable references
- Prepreg insulation layers
- Core layer for mechanical stability
- Surface layers for component connectivity
- Soldermask and silkscreen layers for protection and identification
Stack-up designs are customized for each application to ensure optimal signal integrity, power distribution, and thermal management.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
ONESEINE TECHNOLOGY CO.,LTD
Location
F6,Fangdichan building,Guicheng south,Nanhai,Foshan,China
Contact Person
Tracy