Rogers4350 FR4 Multilayer PCB Prototype Board 1-60 Layers
Price:
USD0.1-1000
MOQ:
1pcs
Delivery Time:
5-8 working days
Brand:
ONESEINE
Product Description
Rogers4350 FR4 Multilayer PCB Board Prototyping 94v 0 Circuit Board
Product Specifications
| Attribute | Value |
|---|---|
| Material | Rogers4350, FR4 |
| Layers | Multilayer |
| Type | Prototype |
| Layer Number | 1-60 |
| Cooper | 1/1oz |
| Base Copper | 50um(1.5oz) |
| Service Available | OEM Acceptable |
| Material | FR4 TG170 |
Product Description
Rogers4350 FR4 Mixed Dielectric Hybrid Stack-Up PCB Prototype
General Information
- Base material: Rogers 4350 0.203mm + FR4
- Layer: 4
- Surface finish: Immersion gold
- Board size: 15.9 × 8.5cm
- Final board thickness: 1.5mm
- Min trace width: 0.2mm
- Solder mask and silk: Yes
- Prototype time: 8-10 days
- 4 layers with 3 cores, calculated as 8 layers (fake 8 layer)
Mixed high frequency construction can reduce costs when the need for RF dielectric is local and only between some layers. The rest of the dielectric can be FR4 or halogen-free FR4. It is also possible to combine PTFE materials with FR4.
Multilayer PCB Production Process
- Design
The design process involves creating the schematic and layout of the PCB using specialized PCB design software, including defining the layer stack-up, trace routing, component placement, and signal integrity considerations.
- CAM (Computer-Aided Manufacturing) Processing
CAM software converts the design data into manufacturing instructions, including generating Gerber files, drill files, and layer-specific information.
- Material Preparation
The core material (typically FR-4 fiberglass epoxy) is cut into appropriate panel sizes. Copper foil sheets are prepared in required thicknesses.
- Inner Layer Processing
- Cleaning: The copper foil is cleaned to remove contaminants
- Lamination: Copper foil is laminated to core material
- Imaging: Photoresist is applied and exposed to define traces
- Etching: Unwanted copper is removed
- Drilling: Precision holes are drilled for vias and mounting
- Outer Layer Processing
Similar to inner layer processing but includes application of soldermask and silkscreen layers for protection and component identification.
- Multilayer Lamination
Processed layers are stacked with prepreg material and bonded under heat and pressure to form a solid multilayer structure.
- Plating and Surface Finish
Vias are electroplated with copper, and exposed surfaces are treated with protective finishes like tin or gold.
- Routing and V-Cut
The PCB panel is routed to separate individual PCBs, with possible V-cut perforation lines.
- Assembly
Electronic components are placed and soldered onto the PCB using reflow or wave soldering processes.
- Testing and Inspection
PCBs undergo automated optical inspection (AOI), functional testing, and other quality checks.
- Packaging and Shipping
Final PCBs are packaged for protection and shipped to destination.
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Company
ONESEINE TECHNOLOGY CO.,LTD
Location
F6,Fangdichan building,Guicheng south,Nanhai,Foshan,China
Contact Person
Tracy