ONESEINE TECHNOLOGY CO.,LTD
                                                                                                           
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8 Layer HDI Multilayer PCB Board Assembly with Blind Vias Prototype

Price Negotiable
Price: USD0.1-1000
MOQ: 1pcs
Delivery Time: 5-8 working days
Brand: ONESEINE
Product Description
Full Turnkey Blind Hole HDI Multilayer PCB Board Prototype Assembly
Attribute Value
Product Name Multilayer PCB
Layer Count 8
Technology HDI
Blind Vias 1
Product Type Printed Circuit Board
Prototype 1
8 Layer Multilayer HDI PCB With Blind Vias Printed Circuit Boards Prototype
General Specifications
Layer: 8
Material: FR4
Thickness: 2.0MM
Surface finish: ENIG
Special: Blind hole, L1-L2, L3-L4, L5-L6, vias filled and capped
Board size: 2*6CM
Solder mask: No
Silk screen: White
Delivery time: 10 days for sample and small/medium batch
Package Details: Inner packing: vacuum packing/plastic bag; outer packing: standard carton packing
Blind Vias Technology
Blind vias connect one outer layer with at least one inner layer. Each connection level requires a separate drill file. The aspect ratio (hole depth to drill diameter) must be ≤ 1. The smallest hole determines the maximum distance between outer and corresponding inner layers.
Key technologies: Microvia, Via-in-Pad
HDI Blind Vias PCB Features
HDI boards represent one of the fastest growing PCB technologies, featuring blind/buried vias and often microvias of ≤0.006 diameter. They offer higher circuitry density than traditional PCBs.
HDI Board Types
  • Through vias from surface to surface
  • With buried vias and through vias
  • Two or more HDI layers with through vias
  • Passive substrate with no electrical connection
  • Coreless construction using layer pairs
  • Alternate coreless constructions
Special HDI Technologies
  • Edge plating for shielding and ground connection
  • Minimum track width/spacing: ~40μm in mass production
  • Stacked microvias (plated copper or conductive paste filled)
  • Cavities, countersunk holes, or depth milling
  • Multiple solder resist color options (black, blue, green, etc.)
  • Low-halogen materials in standard and high Tg range
  • Low-DK materials for mobile devices
  • All industry-standard PCB surface finishes available
Note: For accurate quotation, please provide Gerber files (DXP format etc.) due to the specialized nature of blind vias PCBs.

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company ONESEINE TECHNOLOGY CO.,LTD
Location F6,Fangdichan building,Guicheng south,Nanhai,Foshan,China
Contact Person Tracy

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