High Speed Rigid FR4 PCB Board with HASL and Immersion Gold
Price:
USD0.1-1000
MOQ:
1pcs
Delivery Time:
5-8 working days
Brand:
ONESEINE
Product Description
High Speed Rigid ESP32 FR4 Board PCB Copper HASL Immersion Gold
Product Specifications
| Attribute | Value |
|---|---|
| FOB Price | US $0.01-100/Piece |
| Surface Finishing | HASL, OSP, Immersion Gold |
| Min Hole Size | 0.1mm |
| Min Space | 0.075mm |
| Layer | 1-24 Layers |
| Type | PCB/Printed Circuit Board/OEM PCB |
| Base Material | FR4 |
| Peelable | 0.3-0.5mm |
| Impedance Control | No |
| Component Sourcing | Yes |
Quick Details
| Material | FR4 |
|---|---|
| Layer | 4 |
| Surface | ENIG |
| Copper | 70UM |
| Solder Mask | Green |
| Silkscreen | White |
| Min Line | 3mil |
| Min Hole | 0.15MM |
PCB Types
Rigid PCB: Rigid printed circuit board, cannot bend.
Flexible PCB (FPC): Flexible circuit boards that can be bent.
Flexible PCB (FPC): Flexible circuit boards that can be bent.
FR4 Material Properties
FR-4 is a high-strength, flame-retardant, glass-reinforced epoxy laminate material used to fabricate printed circuit boards. Key properties include:
- High Glass Transition Temperature (Tg) (150Tg or 170Tg)
- High Decomposition Temperature (Td) (>345°C)
- Low Coefficient of Thermal Expansion (CTE) (2.5%-3.8%)
- Dielectric Constant (@1 GHz): 4.25-4.55
- Dissipation Factor (@1 GHz): 0.016
- UL rated (94V-0, CTI = 3 minimum)
- Compatible with standard and lead-free assembly
FR4 Material Types
- Standard FR4: Most common type with good mechanical and moisture resistance
- FR4 With High Tg: For applications requiring temperatures >150°C
- FR4 With High CTI: Better thermal conductivity (CTI >600V)
- FR4 Without Copper Laminate: Non-conductive material for insulating boards
- FR4 G10: Solid core material with excellent mechanical properties
Applications
FR-4 PCBs are widely used in electronic devices, relays, switches, transformers, and various industrial applications requiring reliable circuit boards with good thermal stability.
Thermal Stability
FR4 PCBs offer excellent thermal stability with:
- Glass Transition Temperature (Tg) of 130-180°C
- Low Coefficient of Thermal Expansion (12-18 ppm/°C)
- Compatibility with standard soldering and reflow processes
- Adequate heat dissipation for most electronic applications
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Get in Touch
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Company
ONESEINE TECHNOLOGY CO.,LTD
Location
F6,Fangdichan building,Guicheng south,Nanhai,Foshan,China
Contact Person
Tracy