ONESEINE TECHNOLOGY CO.,LTD
                                                                                                           
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13 Years
Since 2013
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6 Layer Black Solder Mask FR4 PCB Board for UAV Drones

Price Negotiable
Price: USD0.1-1000
MOQ: 1pcs
Delivery Time: 5-8 working days
Brand: ONESEINE
Product Description
Black Solder Mask ESP32 FR4 Double Sided PCB Board for UAV Drone
Product Specifications
Attribute Value
Color Black
Solder mask Yes
Number of layers 6
Material FR4
Product type Drone PCB
Features Remote control, Diagram, Mini drone circuit board, Drone motor
Board Thickness Single/Double: 0.008±0.004"
Lead Time 5-10 Working Days
FR4 PCB Parameters
High precision prototype vs PCB bulk production specifications:
Parameter Prototype Bulk Production
Max Layers 1-28 layers 1-14 layers
MIN Line width (mil) 3mil 4mil
MIN Line space (mil) 3mil 4mil
Min via (mechanical drilling) Board thickness≤1.2mm: 0.15mm
Board thickness≤2.5mm: 0.2mm
Board thickness>2.5mm: Aspect Ration≤13:1
Board thickness≤1.2mm: 0.2mm
Board thickness≤2.5mm: 0.3mm
Board thickness>2.5mm: Aspect Ration≤13:1
Board thickness MAX: 8mm
MIN: 2 layers:0.2mm; 4 layers:0.35mm; 6 layers:0.55mm; 8 layers:0.7mm; 10 layers:0.9mm
MAX: 7mm
MIN: 2 layers:0.2mm; 4 layers:0.4mm; 6 layers:0.6mm; 8 layers:0.8mm
MAX Board size 610*1200mm
Max copper thickness 0.5-6oz
Why Choose Our UAV PCBs
  • 11+ years experience manufacturing UAV PCBs with custom design files
  • Professional flight electronic control circuit boards for FPV UAVs
  • Fast PCB prototyping with production+delivery in as little as 6 days
  • 24-hour quick sample service available
  • No minimum quantity - single prototypes accepted
  • One-time tooling charge for repeat orders
  • Detailed quotations provided within 1 hour
  • Cost-effective solutions to maximize customer benefits
FR4 Material Properties
Our standard FR-4 material features:
  • High Glass Transition Temperature (Tg) (150Tg or 170Tg)
  • High Decomposition Temperature (Td) (> 345º C)
  • Low Coefficient of Thermal Expansion (CTE) (2.5%-3.8%)
  • Dielectric Constant (@1 GHz): 4.25-4.55
  • Dissipation Factor (@ 1 GHz): 0.016
  • UL rated (94V-0, CTI = 3 minimum)
  • Compatible with standard and lead-free assembly
Thermal Stability of FR4 PCBs
FR4 PCBs demonstrate excellent thermal stability with:
  • Glass Transition Temperature (Tg) of 130-180°C
  • Low Coefficient of Thermal Expansion (CTE) of 12-18 ppm/°C
  • Compatibility with standard soldering and reflow processes
  • Good dimensional stability across temperature ranges
  • Flame retardant properties for enhanced safety
FR4 PCB Applications
FR-4 is widely used in:
  • Printed circuit boards (PCBs) with copper clad laminates
  • Relays, switches, and standoffs
  • Busbars and washers
  • Arc shields and transformers
  • Screw terminal strips
High quality FR4 PCB board for drone applications

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company ONESEINE TECHNOLOGY CO.,LTD
Location F6,Fangdichan building,Guicheng south,Nanhai,Foshan,China
Contact Person Tracy

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