ONESEINE TECHNOLOGY CO.,LTD
                                                                                                           
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Since 2013
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HDI PCB Fabrication 1.0mm FR4 Multilayer Circuit Board

Price Negotiable
Price: USD0.1-1000
MOQ: 1pcs
Delivery Time: 5-8 working days
Brand: ONESEINE
Product Description
Copper Clad Laminate Multilayer HDI PCB Fabrication Circuit Board 1.0mm
Product Specifications
Attribute Value
Layers 1-16
Impedance Control 50ohm +/-10%
Port Shenzhen
Surface Mount Pad Copper, Gold, Tin, Silver
Component Sourcing Yes
Min Line Space 8mil
Thickness 0.2mm-6.0mm
Board Thickness 1.2mm
Product Overview

FR4 Copper Clad Laminate Multilayer HDI 1.0mm PCB designed for mobile phone applications and other compact electronic devices.

Quick Specifications
  • Material: FR4
  • Layer: 4
  • Surface finish: Immersion gold
  • Copper weight: 1oz
  • Board size: 4.5*3cm
  • Total thickness: 1.6mm
  • Min line width and space: 3mil
  • Min hole: 0.15mm
HDI PCB Technology

HDI (High Density Interconnector) PCBs utilize micro blind buried hole technology to create compact circuit boards for small-capacity applications. These boards feature microvias as interconnects between layers to accommodate high input/output density in advanced packages.

Key Features
  • Reduces PCB cost while increasing line density
  • Enhanced electrical performance and signal integrity
  • Improved reliability and thermal properties
  • Better RFI/EMI/ESD protection
  • Increased design efficiency
Technical Specifications
Feature Technical Specification
Number of layers 4 - 22 layers standard, 30 layers advanced
Technology highlights Multilayer boards with higher connection pad density, finer lines/spaces, and smaller via holes
HDI builds 1+N+1, 2+N+2, 3+N+3, 4+N+4, any layer in R&D
Materials FR4 standard, FR4 high performance, Halogen free FR4, Rogers
Copper weights (finished) 18um - 70um
Minimum track and gap 0.075mm / 0.075mm
PCB thickness 0.40mm - 3.20mm
Surface finishes available OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers
Applications

Widely used in mobile phones, digital cameras, MP3/MP4 players, computers, automotive electronics, and other compact digital devices where space optimization is critical.

FR4 Material Properties

FR4 PCBs offer excellent thermal stability, high mechanical strength, moisture resistance, and chemical resistance. The material consists of copper foil laminated onto a woven fiberglass substrate with epoxy resin, providing good dimensional stability and low electrical conductivity.

HDI PCB Circuit Board Sample

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company ONESEINE TECHNOLOGY CO.,LTD
Location F6,Fangdichan building,Guicheng south,Nanhai,Foshan,China
Contact Person Tracy

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