FR4 Double Sided PCB with Immersion Gold Plating

Quotations based on standard design without blind buried holes, with line width and space >5mil, HASL surface, and 1OZ copper weight.

FR-4 is the standard material for printed circuit boards (PCBs), featuring copper foil laminated to one or both sides of a glass epoxy panel. These copper clad laminates are available in various copper thicknesses.

Common applications include:

• Relays and switches
• Standoffs and busbars
• Washers and arc shields
• Transformers and screw terminal strips
• Consumer electronics and telecommunications
• Automotive and industrial equipment

FR4 PCBs demonstrate excellent thermal stability with these key characteristics:

• Glass Transition Temperature (Tg): 130-180°C range maintains mechanical properties at elevated temperatures
• Coefficient of Thermal Expansion (CTE): 12-18 ppm/°C minimizes stress during thermal cycling
• Thermal Conductivity: Adequate for most applications, with options for enhanced heat dissipation
• Process Compatibility: Withstands standard soldering and reflow temperatures

Note: While FR4 offers excellent thermal performance, extreme conditions may require additional design considerations.

The FR4 substrate combines woven fiberglass cloth with epoxy resin, offering:

• Excellent dimensional stability across temperature ranges
• Low electrical conductivity between traces
• Flame retardant properties for safety compliance
• High mechanical strength and chemical resistance
• Moisture resistance for reliable performance