Aluminum MCPCB Board for LED Lighting with Imm Tin Finish
Price:
USD0.1-1000
MOQ:
1pcs
Delivery Time:
5-8 working days
Brand:
ONESEINE
Product Description
Fluorescent Lamp Aluminum Bare MCPCB Board Imm Tin For LED Lighting
Product Specifications
| Attribute | Value |
|---|---|
| Material | Aluminum |
| Layers | 1 |
| Metal Core | Yes |
| Manufacturer | pcb manufacture |
| Surface Treatment | ENIG, OSP, HASL, Imm Tin, Imm Silver... |
| Conductor Width | 8 mil |
| Product Type | Printed Circuit Board |
| Thermal Conductivity | 1.0 - 8.0 W/mK |
PCB Parameters
- Brand: Oneseine
- Application: Full range of fluorescent lamps
- Maximum size: 1500mm
- Substrate material: Aluminum
- Thickness: 0.6-2.0mm
- Copper foil thickness: 18-70um
- Surface treatment: OSP/HAL/HASL (Lead free)
- Thermal conductivity: 1.0 - 3.0W/m.k
- Breakdown voltage: 1.0-3.0KV(AC)
- Flammability: 94V0
- Standard: UL & ROHS
Metal Core PCB Variants & Manufacturing Specifications
Material Classification:
Metal core PCBs utilize specialized substrates for thermal management:
Metal core PCBs utilize specialized substrates for thermal management:
- Aluminum Core (80% market share)
Applications: LED lighting, automotive electronics, power supplies
Advantages: Cost efficiency (¥120-300/m²), thermal conductivity 1-3 W/mK, lightweight (2.7g/cm³) - Copper Core
Applications: RF/microwave systems, high-power converters
Performance: Superior thermal transfer (400 W/mK), 3× aluminum cost, weight penalty (8.96g/cm³) - Iron Alloy Core
Applications: Motor controllers, EMC-sensitive systems
Characteristics: Magnetic permeability >10k μ, thermal conductivity 80 W/mK - Composite Core
Architecture: Aluminum-copper hybrids (e.g., 1.5mm Al + 0.3mm Cu)
Benefit: Balanced thermal-mechanical performance (CTE 14 ppm/°C) - Ceramic Core
Substrates: Al₂O₃ (24-28 W/mK), AlN (170-230 W/mK)
Use Cases: Aerospace power modules, laser diodes - Flexible Metal Core
Construction: Polyimide-on-aluminum (bend radius >5mm)
Applications: Curved displays, wearable medical devices
Production Process
Advanced thermal management PCBs require 18 specialized stages:
- Design Phase
Thermal simulation (ANSYS Icepak)
CTE-matching component placement - Base Preparation
Metal core CNC milling (±0.05mm tolerance)
Alkaline degreasing + anodization (Al cores) - Dielectric Lamination
Thermally conductive polymers (e.g., Bergquist HT-04503, 100μm±5μm)
Bonding strength >8N/mm² after 260°C reflow - Circuit Formation
Laser Direct Imaging (25μm feature resolution)
Acidic copper etching (1oz-10oz thickness) - Drilling & Metallization
Laser/mechanical drilling (0.2-6.0mm holes)
Void-free via filling (conductive epoxies) - Surface Finishing
Ni/Au (ENIG): 3-5μm Ni + 0.05-0.1μm Au
Immersion Sn/Ag: Low-cost alternatives - Validation
Thermal cycling (-55°C↔150°C, 500 cycles)
IST testing (1000+ hours @ 150°C)
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
ONESEINE TECHNOLOGY CO.,LTD
Location
F6,Fangdichan building,Guicheng south,Nanhai,Foshan,China
Contact Person
Tracy