China HDI PCB Prototype with Blind Buried Vias 3mil Line Space
Price:
USD0.1-1000
MOQ:
1pcs
Delivery Time:
5-8 working days
Brand:
ONESEINE
Product Description
Buried Via Proto Flexible HDI PCB Board Prototype 3mil High Density Interconnect
Product Specifications
| Attribute | Value |
|---|---|
| Product | Prototype PCB products |
| Region | China |
| Features | Blind via, Buried via |
| PCB Kind | HDI PCB |
| Silkscreen Color | White, Black, Yellow |
| Minimum Line Width/Spacing | 3/3 mil |
| Min Line Space | 3mil |
| Solder Mask | Green/Yellow/Red/Black |
Technical Parameters
Product Category: Blind Buried Hole Board
Number of layers: 4
Board thickness: 1.6+/-0.16mm
Size: 78*125mm/10
Plate used: Shengyi S1141
Minimum aperture: 0.1mm
Surface treatment: Immersion gold
Minimum hole copper: 25um
Table copper thickness: 56um
Minimum line width/distance: 0.088mm/0.089mm
Configuration: 6-layer 1 step blind buried via
Characteristic Impedance Calculation Methods
1. Empirical Formulas:
Empirical formulas provide approximate calculations of characteristic impedance based on simplified assumptions. The most commonly used formula is the microstrip transmission line formula:
Zc = (87 / √εr) * log(5.98h / W + 1.74b / W)
Where:
- Zc = Characteristic impedance
- εr = Relative permittivity (dielectric constant) of the PCB material
- h = Height of the dielectric material (trace thickness)
- W = Width of the trace
- b = Separation between the trace and the reference plane (ground plane)
Note that empirical formulas provide approximate results and may not account for all PCB structure complexities.
2. Field Solver Simulations:
For more accurate results, electromagnetic field solver simulations can be performed using specialized software tools. These consider:
- Specific layer stackup
- Trace geometry
- Dielectric materials
- Other critical factors
Recommended software tools include Ansys HFSS, CST Studio Suite, or Sonnet for high-frequency applications requiring precise impedance control.
HDI PCB Applications
- Mobile Devices: Smartphones, tablets with integrated processors, memory, sensors, and wireless modules
- Computing & Networking: Laptops, servers, routers, switches supporting high-speed data processing
- Medical Devices: Diagnostic machines, imaging systems, patient monitoring with miniaturized components
- Automotive Electronics: ADAS, infotainment systems, vehicle connectivity in compact spaces
- Aerospace & Defense: Avionics, satellites, radar systems with demanding performance requirements
- Industrial & IoT: Automation systems, smart devices for energy management and environmental monitoring
Automotive Implementation Challenges
- Reliability: Must withstand temperature variations, vibrations, and moisture in harsh environments
- Signal Integrity: Managing crosstalk, impedance matching, and signal degradation in high-density designs
- Thermal Management: Effective heat dissipation solutions for increased power densities
- Manufacturing Complexity: Requires specialized equipment for laser drilling and fine-pitch assembly
- Cost Factors: Advanced materials and processes increase production expenses
- Regulatory Compliance: Meeting strict automotive safety and reliability standards
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
ONESEINE TECHNOLOGY CO.,LTD
Location
F6,Fangdichan building,Guicheng south,Nanhai,Foshan,China
Contact Person
Tracy