Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.
                                                                                                           
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OEM Dielectric Film Adhesiveless Polyimide For High Speed Electronics

Price Negotiable
Price: $300-$30000
MOQ: 5kg
Delivery Time: Negotiation
Brand: Guofeng
Product Description
Low-Dk Polyimide Film GL-25G for High-Speed Electronics
Product Overview

Low-Dielectric Polyimide Film (Low-Dk PI Film) is an advanced polymer material engineered to exhibit ultra-low dielectric constant (Dk < 3.0) and minimal dielectric loss (Df < 0.005) across high-frequency ranges (1 MHz-100 GHz). It retains the intrinsic thermal stability (>300°C) and mechanical robustness of polyimide while addressing signal integrity demands in high-speed electronics.

Key Characteristics
  • Ultra-low dielectric constant (Dk < 3.0)
  • Minimal dielectric loss (Df < 0.005)
  • Excellent performance across 1 MHz-100 GHz frequency range
  • High thermal stability (>300°C)
  • Maintains mechanical robustness of standard polyimide
  • Optimized for high-speed electronic applications

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.
Location No.4266, Dongfang Avenue, Xinzhan District, Hefei, China
Contact Person Jihao

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