Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.
                                                                                                           
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Lightweight Yellow Polyimide Thin Film PMDA ODA Molecular Structure

Price Negotiable
Price: $300-$30000
MOQ: Negotiation
Delivery Time: Negotiation
Brand: Guofeng
Product Description
Lightweight Yellow Polyimide Thin Film PMDA ODA Molecular Structure
Introduction
Lightweight yellow polyimide thin film, primarily based on the PMDA-ODA (pyromellitic dianhydride-oxydianiline) molecular structure, is a high-performance polymer material known for its exceptional thermal stability, mechanical strength, and electrical insulation properties. Its distinctive yellow color and lightweight nature make it ideal for demanding applications in extreme environments.
Key Properties
  1. Extreme Thermal Stability

    • Continuous service temperature range from -269°C to +400°C.

    • Glass transition temperature (Tg) exceeding 400°C.

  2. Excellent Mechanical Properties

    • High tensile strength (≥200 MPa) and modulus (≥2.5 GPa).

    • Outstanding flexibility and tear resistance even at ultrathin dimensions (e.g., 7.5-125 μm).

  3. Superior Electrical Insulation

    • Dielectric strength: ≥5,000 V/μm.

    • Low dielectric constant (≈3.2 at 1 kHz) and dissipation factor.

  4. Chemical and Radiation Resistance

    • Resists organic solvents, acids, and radiation (gamma, X-ray).

    • Minimal outgassing in vacuum environments.

  5. Lightweight and Dimensional Stability

    • Density: ~1.42 g/cm³, making it lighter than many metal alternatives.

    • Low coefficient of thermal expansion (CTE: 30-50 ppm/°C).

  6. Flame Resistance

     

     

    • UL 94 V-0 rated; self-extinguishing without emitting toxic fumes.

    Application Scenarios

     

    • Aerospace and Aviation
      Used as thermal blankets, insulation for spacecraft wiring, and protective layers in satellite components due to its radiation resistance and thermal stability.

    • Electronics and Semiconductors
      Employed as flexible printed circuit (FPC) substrates, coverlays, and stress buffers in microelectronics packaging for smartphones, wearables, and displays.

    • Energy and Electric Vehicles
      Serves as insulation films for lithium-ion batteries, motor slot liners, and high-voltage capacitor dielectrics in EVs and renewable energy systems.

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Company Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.
Location No.4266, Dongfang Avenue, Xinzhan District, Hefei, China
Contact Person Jihao

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