Advanced Copper-Polyimide Composite Structured Substrate
The GL series represents a significant advancement in polyimide film technology. Utilizing our proprietary biaxial stretching process, we engineer a molecularly oriented structure that delivers a consistent 30% enhancement in key properties—including tensile strength, dimensional stability, and chemical resistance—compared to standard alternatives. This high-performance, natural yellow polyimide film is available in customized thicknesses and is the preferred material for demanding applications such as adhesive substrates and advanced chip packaging.
Outstanding Mechanical Strength
Exceptional Dimensional Stability
Superior Laminating Properties
Conforms to RoHS and REACH regulations.
The GL high-performance polyimide film is primarily used in:
High-precision adhesive FCCL substrates
High-stability cover films
Chip packaging
Special adhesive tape substrates
To ensure the longevity and performance of our Polyimide film:
- Shelf Life: 6 months from the date of manufacture
- Storage Conditions:
- Store in a cool, dry place away from direct sunlight
- Avoid exposure to high humidity or extreme temperature fluctuations
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