ODM Polyimide Film Adhesive Substrate For Flexible Electronics Chip Packaging
The GL high-performance polyimide film is a type of biaxially stretched natural (yellow) polyimide film, developed and produced independently by our company. Available in various thicknesses and characteristics, it is primarily used in adhesive substrates, chip packaging, and other specialized applications.
- Extremely high mechanical properties
- Extremely low coefficient of thermal expansion
- Excellent surface bonding properties
- Complies with RoHS and Reach requirements
- UL laboratory safety certified (United States)
The GL high-performance polyimide film is primarily used in:
- High-precision adhesive FCCL substrates
- High-stability cover films
- Chip packaging
- Special adhesive tape substrates
- Direct Manufacturer Pricing: Eliminate intermediaries with competitive costs, flexible MOQs, and fast delivery
- Technical Expertise: Customized anti-fog testing and packaging optimization support
Available in custom thicknesses, widths, and finishes (matte, glossy, metallic), our Polyimide film ensures consistent quality, fast production, and competitive pricing for bulk orders. Contact us today for free samples & wholesale deals!
To ensure the longevity and performance of our Polyimide film:
- Shelf Life: 6 months from the date of manufacture
- Storage Conditions:
- Store in a cool, dry place away from direct sunlight
- Avoid exposure to high humidity or extreme temperature fluctuations
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