Engineered Copper-Polyimide Laminate for Flexible Circuits
The GL series redefines the performance standard for polyimide film technology. Our proprietary biaxial stretching process creates a uniquely molecularly oriented structure, delivering greater than 30% enhancement in critical properties—from tensile strength and dimensional stability to chemical resistance—when benchmarked against conventional films. This high-performance, natural yellow polyimide film is available in customized thicknesses, establishing it as the material of choice for the most demanding applications, including high-reliability adhesive substrates and advanced chip packaging.
Outstanding Mechanical Strength
Exceptional Dimensional Stability
Superior Laminating Properties
Conforms to RoHS and REACH regulations
The GL high-performance polyimide film is primarily used in:
High-precision adhesive FCCL substrates
High-stability cover films
Chip packaging
Special adhesive tape substrates
To ensure the longevity and performance of our Polyimide film:
- Shelf Life: 6 months from the date of manufacture
- Storage Conditions:
- Store in a cool, dry place away from direct sunlight
- Avoid exposure to high humidity or extreme temperature fluctuations
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