Polyimide-film-based, precision-laminated copper substrate for flexible circuits
The GL series is a leap forward in polyimide film performance. Its proprietary manufacturing process creates a uniquely oriented molecular structure, boosting essential properties like tensile strength, dimensional stability, and chemical resistance by a consistent 30%. This versatile, naturally yellow film is available in custom thicknesses and is the ideal solution for demanding uses such as adhesive substrates and advanced chip packaging.
Robust Mechanical Durabilit
Exceptional Dimensional Integrity
Excellent Lamination Performance
Compliant with RoHS and REACH
Serves as a base material for high-precision adhesive Flexible Copper Clad Laminates (FCCL)
Functions as a highly dimensionally stable cover layer
Applied in semiconductor chip packaging
Used as a base film for specialized adhesive tapes
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