Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.
                                                                                                           
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Polyimide film clad with copper used in flexible circuit settings

Price Negotiable
Price: $300-$30000
MOQ: 150kg
Delivery Time: 7 Working Days
Brand: Guofeng
Product Description
              Polyimide film clad with copper used in flexible circuit settings
Product Overview:

Copper-Clad Polyimide Film (abbreviated as PI Copper Foil) is a high-performance composite material specifically developed for flexible circuit scenarios. It combines high-purity copper foil with a polyimide (PI) base film through a precision lamination process, integrating the bend resistance of flexible substrates and the electrical conductivity of metal conductors. As a core foundational material for flexible electronic devices, it enables the realization of "thinness, lightness, bendability, and high reliability"

Place of Origin:
ANHUI, CHINA
Material:
Polyimide
Color:
Yellow
Treatment:
Single-side / Both Sides
Width:
514MM, 520MM, 1028MM, 1040MM
Thickness:
custom
Packaging:
vacuum packaging
Supply Ability:
2000 ton/year
Product Features:

Robust Mechanical Durabilit

Exceptional Dimensional Integrity

Excellent Lamination Performance
Compliant with RoHS and REACH


Product Applications:
  1. Consumer Electronics Field
  2. Industrial and Medical Field
  3. Medical equipment
  4. Flexible solar cells

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Company Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.
Location No.4266, Dongfang Avenue, Xinzhan District, Hefei, China
Contact Person Jihao

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