Copper Clad Polyimide Film for Flexible Circuitry Applications with Robust Mechanical Durability and RoHS Compliance
Price:
$300-$30000
MOQ:
150kg
Delivery Time:
7 Working Days
Brand:
Guofeng
Product Description
Copper-Clad Polyimide Membrane for Flexible Circuitry
Copper-Laminated Polyimide Film (PI Copper Foil) is a premium composite material specifically engineered for flexible circuitry applications. This advanced material combines high-grade pure copper foil with a polyimide base membrane through precision laminating technology, delivering both the flexibility of polymer substrates and the electrical conductivity of metallic conductors.
As a fundamental component in flexible electronic systems, this material enables the development of thin-profile, lightweight designs with exceptional bendability and reliability.
Product Specifications
| Place of Origin | ANHUI, CHINA |
| Material | Polyimide |
| Color | Yellow |
| Treatment | Single-side / Both Sides |
| Width | 514MM, 520MM, 1028MM, 1040MM |
| Thickness | Custom |
| Packaging | Vacuum Packaging |
| Supply Ability | 2000 ton/year |
Key Features
- Robust Mechanical Durability
- Exceptional Dimensional Integrity
- Excellent Lamination Performance
- Compliant with RoHS and REACH Standards
Applications
- Consumer Electronics
- Industrial Equipment
- Medical Equipment
- Flexible Solar Cells
Product Images
Related product: Polyimide film
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Get in Touch
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Company
Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.
Location
No.4266, Dongfang Avenue, Xinzhan District, Hefei, China
Contact Person
Jihao