Copper-clad laminate utilizing polyimide film for high-precision flexible circuit applications
Product Overview
The GL series represents a significant advance in polyimide film technology. Its patented production method yields a specially aligned molecular architecture, enhancing critical attributes—including tensile strength, dimensional stability, and chemical resistance—by a uniform 30%. This adaptable, naturally amber film is offered in tailored thicknesses and serves as the premier choice for high-performance applications such as adhesive carriers and sophisticated chip encapsulation.
The GL series excels in demanding electronic manufacturing processes, where its enhanced properties are critical. It acts as the structural backbone in high-precision adhesive FCCL (Flexible Copper Clad Laminate) production. Its inherent stability also qualifies it as a premium choice for critical coverlay applications. Furthermore, it meets the stringent requirements of advanced semiconductor chip encapsulation and forms the durable core layer for high-performance specialty adhesive tapes.
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