High-Reliability Copper-Polyimide Composites for Dynamic Bending Applications
Price:
$300-$30000
MOQ:
150kg
Delivery Time:
7 Working Days
Brand:
Guofeng
Product Description
High-Reliability Copper-Polyimide Composites for Dynamic Bending Applications
Product Overview:
The GL series polyimide substrates forge unprecedented performance benchmarks across the polyimide film sector. Leveraging in-house developed fabrication techniques, our product re-engineers the intrinsic molecular structure at the fundamental level. Compared with generic PI film goods, its core functional indicators such as tensile performance, dimensional stability and chemical corrosion resistance see a more than 30% performance uplift.
Place of Origin:
ANHUI, CHINA
Material:
Polyimide
Color:
Yellow
Treatment:
Single-side / Both Sides
Width:
514MM, 520MM, 1028MM, 1040MM
Thickness:
custom
Packaging:
vacuum packaging
Supply Ability:
2000 ton/year
Product Features:
- Outstanding Mechanical Strength
- Exceptional Dimensional Stability
- Superior Laminating Properties
- Conforms to RoHS and REACH regulations
Product Applications:
- High-density flexible copper clad laminates (FCCL) for FPC fabrication
- Dimensionally stable coverlays for circuit protection
- Advanced encapsulation and packaging for semiconductor devices
- High-performance substrates for specialty adhesive tapes
To preserve the integrity and performance of our Polyimide film, please adhere to the following storage guidelines:
- Shelf Life: 6 months from the manufacturing date.
- Optimal Environment: Store in a cool, dry place with stable ambient conditions.
- Protection Measures: Keep the original packaging sealed and protect from direct sunlight, moisture, and extreme temperatures.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.
Location
No.4266, Dongfang Avenue, Xinzhan District, Hefei, China
Contact Person
Jihao