Engineered for consistent performance across thousands of test insertions, this semiconductor test socket prevents off-axis actuation that can cause uneven contact force or premature probe wear. Precision-machined guide holes with chamfered lead-ins and optimized clearance profiles ensure smooth compression of pogo pins, delivering repeatable contact resistance, extended socket life, and superior reliability in high-throughput ATE environments.

• Hard-coat anodizing (Aluminum substrates)
• Electroless Nickel (50-100 µin thickness)
• Gold Flash (0.1-0.3 µin) for enhanced conductivity

• Class 100 cleanroom packaging environment
• Non-volatile residue <5 µg/cm²
• Ion-free packaging option available

• CTE-matched polymers or ceramic-filled compounds resist thermal distortion
• Maintains dimensional stability at temperatures >150°C during HTOL and burn-in
• Prevents warping, misalignment, or probe disengagement under thermal cycling
• Designed for >100,000 insertions with high-hardness composites
• PTFE fillers or dry-film coatings reduce friction, galling, and particle generation